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MC10165FN

Onsemi

MC10165FN by Onsemi

MC10165FN by Onsemi is an 8-bit digital arithmetic circuit with a propagation delay of 4ns. It operates b/w -30 °C to 85°C, suitable for ECL technology applications. The chip carrier package style with quad terminals and tin-lead finish makes it ideal for surface-mount usage in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,036 parts In-Stock

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Vyrian

USA . 77 parts In-Stock

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77

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SupplyDigital Components

Austria . 5,838 parts In-Stock

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Corphita

USA . 1,345 parts In-Stock

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Kulean Microsystems

USA . 1,159 parts In-Stock

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TANS Electronics

Latvia . 898 parts In-Stock

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UHIMA Technologies

Türkiye . 601 parts In-Stock

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Problanco Electronics

Mexico . 409 parts In-Stock

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Corohmni

South Africa . 52 parts In-Stock

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Overview

Elevate your digital arithmetic circuits with the MC10165FN by Onsemi. Experience unmatched quality and reliability from a trusted manufacturer, delivering cutting-edge solutions for your applications. From high-speed data processing to precision calculations, this product offers unparalleled value and performance. Upgrade your designs with the MC10165FN and unlock a world of possibilities in digital arithmetic circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, ideal for portable devices and long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto printed circuit boards, saving time and cost in production.

No. of Bits: 8

Having 8 bits allows for a wide range of calculations and operations to be performed, making the product versatile and capable of handling complex tasks.

Propagation Delay (tpd): 4 ns

A low propagation delay of 4 ns ensures quick and efficient data processing, making the product suitable for high-speed applications.

Technology: ECL

ECL (Emitter-Coupled Logic) technology offers high-speed operation and low power consumption, making the product energy-efficient and suitable for fast data processing.

Technical Specifications

Digital Arithmetic Circuits MC10165FN attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

10K

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.965 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

4 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10165FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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