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MC100E160FNR2

Onsemi

MC100E160FNR2 by Onsemi

MC100E160FNR2 by Onsemi is a 12-bit digital arithmetic circuit with ECL technology. It operates at a nominal voltage of 5V and has a propagation delay of 0.7ns. This chip carrier package is suitable for applications requiring fast computation in environments ranging from 0 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,346 parts In-Stock

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Digiode

USA . 2,339 parts In-Stock

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Andel Nordic

Denmark . 2,209 parts In-Stock

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$4.910

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$4.713

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$4.713

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$4.713

TANS Electronics

Latvia . 6,950 parts In-Stock

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Kulean Microsystems

USA . 6,558 parts In-Stock

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Problanco Electronics

Mexico . 5,743 parts In-Stock

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SupplyDigital Components

Austria . 4,681 parts In-Stock

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Corphita

USA . 1,074 parts In-Stock

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UHIMA Technologies

Türkiye . 960 parts In-Stock

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Corohmni

South Africa . 134 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the MC100E160FNR2 by Onsemi. Known for their superior quality and reliability, Onsemi delivers cutting-edge technology with a focus on innovation. This product offers a seamless integration into a variety of applications, providing customers with unmatched value and performance. Get ready to experience faster processing speeds, improved efficiency, and precise outputs with the MC100E160FNR2. Elevate your projects to the next level with this top-of-the-line digital arithmetic circuit.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for electronic components.

Surface Mount: YES

Easy and efficient installation on circuit boards.

No. of Bits: 12

High precision and accuracy for digital arithmetic calculations.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply for compatibility with various systems.

Propagation Delay (tpd): 0.7 ns

Fast response time for quick arithmetic operations.

Technology: ECL

ECL technology offers high-speed performance and low power consumption.

Output Polarity: COMPLEMENTARY

Provides both positive and negative outputs for versatile applications.

Technical Specifications

Digital Arithmetic Circuits MC100E160FNR2 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE= -4.2V TO -5.7V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

12

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

-4.5

Propagation Delay (tpd):

.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100E160FNR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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