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MC10166L

Onsemi

MC10166L by Onsemi

MC10166L by Onsemi is a 5-bit digital arithmetic circuit with -5.2V power supply, 7.6ns propagation delay, and ECL technology. It is used in applications requiring true output polarity, operating b/w -30 to 85 °C temperatures, with a rectangular package style and through-hole terminal form.

Median Price

$19.597

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 5 parts In-Stock

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$17.024

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$17.875

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$16.854

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American Microsemiconductor Inc.

USA . 56 parts In-Stock

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$22.170

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Vyrian

USA . 1,766 parts In-Stock

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Digiode

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Electronic Expediters

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Q Components

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Inland Empire Components Inc.

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Bristol Electronics

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Electronics Depot

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Resion

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LWI Electronics Inc

India . 7 parts In-Stock

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Beltway Electronics Company

USA . 5 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Corohmni

South Africa . 67 parts In-Stock

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Kulean Microsystems

USA . 7,465 parts In-Stock

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SupplyDigital Components

Austria . 6,438 parts In-Stock

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Problanco Electronics

Mexico . 6,274 parts In-Stock

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TANS Electronics

Latvia . 3,383 parts In-Stock

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Corphita

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UHIMA Technologies

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Kepictronics

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Assy Fe

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Overview

Unleash the power of digital arithmetic circuits with the MC10166L by Onsemi. Crafted with precision using high-quality materials, this rectangular-shaped module offers unparalleled performance in various applications. From data processing to signal manipulation, this 5-bit marvel delivers fast propagation delays and true output polarity, ensuring accurate results every time. Experience the reliability and efficiency of Onsemi products with the MC10166L, where value meets innovation for all your circuit needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body materials provide durability and protection for the internal components, ensuring a longer lifespan for the product.

No. of Bits: 5

Having 5 bits allows for a decent level of precision and accuracy in digital arithmetic calculations, making this product suitable for various applications.

Propagation Delay (tpd): 7.6 ns

With a low propagation delay of 7.6 ns, this product can perform calculations quickly and efficiently, ideal for high-speed digital arithmetic operations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures that the product can withstand heat and operate reliably in various environments.

Technology: ECL

Utilizing ECL (Emitter-Coupled Logic) technology offers high-speed and low-power consumption benefits, making this product efficient for digital arithmetic circuits.

Technical Specifications

Digital Arithmetic Circuits MC10166L attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

10K

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.49 mm

Logic IC Type:

No. of Bits:

5

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

-5.2

Propagation Delay (tpd):

7.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC10166L Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-069-3887, 5962010693887

NIIN

010693887

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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