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MC10160FNR2

Onsemi

MC10160FNR2 by Onsemi

MC10160FNR2 by Onsemi is a 12-bit digital arithmetic circuit with 7.5ns propagation delay. It operates b/w -30 to 85 °C, in a square chip carrier package style. Ideal for applications requiring fast arithmetic calculations in compact electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Digiode

USA . 623 parts In-Stock

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623

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Vyrian

USA . 370 parts In-Stock

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370

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Distributors (Availability)

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Kulean Microsystems

USA . 7,243 parts In-Stock

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7,243

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Problanco Electronics

Mexico . 5,372 parts In-Stock

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5,372

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TANS Electronics

Latvia . 3,047 parts In-Stock

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3,047

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SupplyDigital Components

Austria . 2,301 parts In-Stock

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UHIMA Technologies

Türkiye . 878 parts In-Stock

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878

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Corphita

USA . 568 parts In-Stock

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568

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Corohmni

South Africa . 298 parts In-Stock

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Overview

Discover the power and efficiency of the MC10160FNR2 by Onsemi. Designed with precision and reliability in mind, this digital arithmetic circuit offers unparalleled performance for a variety of applications. With Onsemi's reputation for high-quality components, you can trust that this product will exceed your expectations. Whether you're looking to streamline your operations or enhance the functionality of your devices, the MC10160FNR2 delivers value, benefits, and advantages that will take your projects to the next level. Elevate your technology with Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the circuits within the package.

Surface Mount: YES

Easy surface mounting capability allows for simplified installation and integration into circuit boards.

Propagation Delay (tpd): 7.5 ns

Fast propagation delay of 7.5 ns ensures efficient and high-speed operation of the arithmetic circuits.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand demanding environmental conditions.

Width: 8.965 mm

Compact width of 8.965 mm allows for space-saving design and easy placement within electronic devices.

Technical Specifications

Digital Arithmetic Circuits MC10160FNR2 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

10K

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.965 mm

Logic IC Type:

No. of Bits:

12

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10160FNR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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