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MC100E193FN

Onsemi

MC100E193FN by Onsemi

MC100E193FN by Onsemi is an 8-bit digital arithmetic circuit with a propagation delay of 1.15 ns. Operating b/w 0-85 °C, it has a supply voltage range of 4.2-5.7 V and features open-emitter output characteristics. Ideal for applications requiring fast arithmetic operations in compact spaces due to its small chip carrier package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,242 parts In-Stock

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Vyrian

USA . 897 parts In-Stock

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Andel Nordic

Denmark . 741 parts In-Stock

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$11.432

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$10.975

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$10.975

741

$11.432

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$10.975

$10.975

SupplyDigital Components

Austria . 4,842 parts In-Stock

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Kulean Microsystems

USA . 2,757 parts In-Stock

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Problanco Electronics

Mexico . 2,628 parts In-Stock

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Corphita

USA . 974 parts In-Stock

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UHIMA Technologies

Türkiye . 425 parts In-Stock

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Corohmni

South Africa . 277 parts In-Stock

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TANS Electronics

Latvia . 58 parts In-Stock

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Overview

Unlock the power of digital arithmetic circuits with the MC100E193FN by Onsemi. Designed with precision and expertise, this high-quality product offers unparalleled performance and reliability in a variety of applications. From data processing to signal manipulation, this versatile chip carrier is the perfect solution for your electronic needs. With a true output polarity and fast propagation delay of just 1.15 ns, you can trust this device to deliver accurate results every time. Experience the value and benefits that Onsemi brings to the table with the MC100E193FN - the ultimate choice for your digital arithmetic circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the digital arithmetic circuit, making it reliable for long-term use.

No. of Bits: 8

With 8 bits, this digital arithmetic circuit can perform complex calculations and processing tasks effectively, making it suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making integration into existing systems easy.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this digital arithmetic circuit can withstand extended periods of use in demanding environments without compromising performance.

Technology: ECL

Utilizing ECL technology ensures high-speed operation and low power consumption, making this digital arithmetic circuit efficient and suitable for applications requiring fast processing.

Technical Specifications

Digital Arithmetic Circuits MC100E193FN attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE= -4.2V TO -5.7V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

-4.5

Propagation Delay (tpd):

1.15 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100E193FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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