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MC10165L

Onsemi

MC10165L by Onsemi

MC10165L by Onsemi is an 8-bit digital arithmetic circuit with a propagation delay of 4ns. It operates in temperatures ranging from -30 °C to 85°C, making it suitable for various applications requiring fast calculations. The package style is in-line, with a rectangular shape and dual terminal position.

Median Price

$1.988

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 222 parts In-Stock

1+ parts

-

100+ parts

$1.590

1k+ parts

$1.320

10k+ parts

$1.180

222

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$1.590

$1.320

$1.180

DigiKey

USA . 222 parts In-Stock

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-

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$1.990

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222

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$1.990

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Verical

USA . 222 parts In-Stock

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$1.988

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222

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$1.988

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Distributors (In-Stock)

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Digiode

USA . 277 parts In-Stock

1+ parts

$1.235

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277

$1.235

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Forefront Electronics and Design

USA . 1 parts In-Stock

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$9.800

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1

$9.800

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Freelance Electronics

USA . 5 parts In-Stock

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$10.550

100+ parts

$11.078

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$10.444

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-

5

$10.550

$11.078

$10.444

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Vyrian

USA . 2,751 parts In-Stock

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Electronic Expediters

USA . 248 parts In-Stock

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Elcom Components

USA . 33 parts In-Stock

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Electronics Depot

USA . 14 parts In-Stock

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Resion

USA . 13 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 469 parts In-Stock

1+ parts

$1.170

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469

$1.170

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Corohmni

South Africa . 475 parts In-Stock

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$1.300

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475

$1.300

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Microchip USA

USA . 12,503 parts In-Stock

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TANS Electronics

Latvia . 7,441 parts In-Stock

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SupplyDigital Components

Austria . 6,032 parts In-Stock

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Kulean Microsystems

USA . 5,420 parts In-Stock

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Problanco Electronics

Mexico . 4,994 parts In-Stock

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4,994

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UHIMA Technologies

Türkiye . 276 parts In-Stock

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Kepictronics

USA . 240 parts In-Stock

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Assy Fe

Spain . 70 parts In-Stock

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Overview

Unlock the power of precision with the MC10165L by Onsemi. Crafted with top-notch quality and expertise, this digital arithmetic circuit offers unparalleled performance and reliability. Ideal for a wide range of applications, this product guarantees seamless integration and efficient operation, maximizing value for customers. Experience the advantages of Onsemi's cutting-edge technology and elevate your projects to new heights with the MC10165L.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed body material ensures durability and protection for the internal components, making this product ideal for long-term use in various environments.

No. of Bits: 8

Having 8 bits allows for processing of complex arithmetic operations with precision, making this product suitable for applications requiring high accuracy.

Propagation Delay (tpd): 4 ns

With a low propagation delay of 4 ns, this product offers fast processing speed, making it efficient for time-sensitive calculations and operations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures that this product can function reliably in environments with elevated temperatures, increasing its versatility.

Technology: ECL

The ECL technology used in this product offers high-speed operation and low power consumption, making it an energy-efficient and reliable choice for digital arithmetic circuits.

Technical Specifications

Digital Arithmetic Circuits MC10165L attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

10K

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.495 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

4 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC10165L Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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