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MC10166P

Onsemi

MC10166P by Onsemi

MC10166P by Onsemi is a 5-bit digital arithmetic circuit with 7.6ns propagation delay. It operates at -30 to 85 °C, has 16 terminals, and uses ECL technology. Ideal for applications requiring true output polarity in a compact IN-LINE package style.

Median Price

$0.987

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,545 parts In-Stock

1+ parts

-

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$0.951

1k+ parts

$0.790

10k+ parts

$0.704

1,545

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$0.951

$0.790

$0.704

DigiKey

USA . 1,545 parts In-Stock

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$1.190

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1,545

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Verical

USA . 1,545 parts In-Stock

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$0.987

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1,545

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$0.987

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Vyrian

USA . 2,120 parts In-Stock

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$0.642

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$0.642

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Digiode

USA . 1,641 parts In-Stock

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$0.741

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$0.741

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American Microsemiconductor Inc.

USA . 50 parts In-Stock

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$6.110

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50

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Electronic Expediters

USA . 3,458 parts In-Stock

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Mentor Electronics Marketing, LLC

USA . 175 parts In-Stock

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Resion

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Sogenti Electronics

Canada . 77 parts In-Stock

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Q Components

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LWI Electronics Inc

India . 59 parts In-Stock

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Zilex Electronics Inc.

Canada . 50 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 19 parts In-Stock

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MRC Electronics

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Electronics Depot

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Mil-Aero Solutions, Inc.

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Prism Electronics

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Sinequanon

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Corohmni

South Africa . 487 parts In-Stock

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$0.642

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487

$0.642

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Corphita

USA . 2,499 parts In-Stock

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$0.702

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Kulean Microsystems

USA . 7,792 parts In-Stock

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TANS Electronics

Latvia . 7,693 parts In-Stock

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Problanco Electronics

Mexico . 1,739 parts In-Stock

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Continental Prestige Electronics

USA . 1,545 parts In-Stock

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$0.662

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SupplyDigital Components

Austria . 1,207 parts In-Stock

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UHIMA Technologies

Türkiye . 939 parts In-Stock

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Assy Fe

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Kepictronics

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Perfect Parts

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Overview

Unlock the power of precision with the MC10166P by Onsemi, a top-notch digital arithmetic circuit designed to elevate your electronic projects. Manufactured by Onsemi, a trusted industry leader known for their superior quality and innovation, this product offers exceptional performance and reliability. With applications in various industries, this 5-bit circuit boasts a propagation delay of 7.6 ns and true output polarity, making it a valuable asset for any design requiring accurate calculations. Trust in Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Package Shape: RECTANGULAR

The rectangular shape allows for easier integration and fitting in various electronic systems.

No. of Bits: 5

With 5 bits, this product offers sufficient precision for digital arithmetic operations.

Power Supplies (V): -5.2

The low power supply voltage of -5.2V enables efficient operation and reduces power consumption.

Propagation Delay (tpd): 7.6 ns

The low propagation delay of 7.6 ns ensures fast and accurate arithmetic calculations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows for reliable performance in various environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish ensures strong connections and enhances the product's lifespan.

Technology: ECL

The ECL technology offers high-speed and low-power operation, making the product suitable for critical arithmetic applications.

Technical Specifications

Digital Arithmetic Circuits MC10166P attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

10K

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

Logic IC Type:

No. of Bits:

5

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Propagation Delay (tpd):

7.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC10166P Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-069-3887, 5962010693887

NIIN

010693887

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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