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MC10165FNR2

Onsemi

MC10165FNR2 by Onsemi

MC10165FNR2 by Onsemi is an 8-bit digital arithmetic circuit with a propagation delay of 4ns. It operates b/w -30 °C to 85°C, suitable for ECL technology applications. The chip carrier package style with J bend terminals and quad position makes it ideal for surface mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,526 parts In-Stock

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1,526

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Vyrian

USA . 108 parts In-Stock

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108

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Distributors (Availability)

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Andel Nordic

Denmark . 3,200 parts In-Stock

1+ parts

$6.288

100+ parts

-

1k+ parts

$6.037

10k+ parts

$6.037

3,200

$6.288

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$6.037

$6.037

Kulean Microsystems

USA . 3,012 parts In-Stock

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Problanco Electronics

Mexico . 2,665 parts In-Stock

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2,665

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Corphita

USA . 2,117 parts In-Stock

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2,117

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TANS Electronics

Latvia . 1,946 parts In-Stock

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1,946

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SupplyDigital Components

Austria . 1,009 parts In-Stock

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1,009

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UHIMA Technologies

Türkiye . 933 parts In-Stock

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933

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Corohmni

South Africa . 92 parts In-Stock

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Overview

Unleash the power of precision with the MC10165FNR2 by Onsemi! Crafted with top-quality materials and cutting-edge technology, this digital arithmetic circuit offers unparalleled performance and reliability. Perfect for a wide range of applications, this product delivers lightning-fast propagation delay and operates seamlessly in various temperature conditions. Experience the ultimate in efficiency and accuracy with the MC10165FNR2 - the ideal solution for your circuit design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the digital arithmetic circuit.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Package Shape: SQUARE

Square package shape enables efficient use of space on the PCB, making it ideal for designs with limited space constraints.

No. of Bits: 8

8 bits provide sufficient precision for arithmetic operations in various applications, ensuring accurate calculations.

No. of Terminals: 20

With 20 terminals, this digital arithmetic circuit offers flexibility for connecting to other components in the circuit.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is well-suited for high-density applications, allowing for compact and efficient circuit designs.

Propagation Delay (tpd): 4 ns

Low propagation delay of 4 ns ensures fast processing speed, making this digital arithmetic circuit suitable for real-time applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures reliable performance even in demanding environments.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature of -30 °C allows the digital arithmetic circuit to operate effectively in cold conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity, ensuring reliable connections in the circuit.

Terminal Position: QUAD

Quad terminal position offers multiple connection points, enabling easy integration into the overall circuit design.

Maximum Seated Height: 4.57 mm

Low maximum seated height of 4.57 mm allows for compact integration on the PCB, saving space and enabling sleek designs.

Width: 8.965 mm

Compact width of 8.965 mm offers compatibility with standard PCB layouts, making it easy to incorporate into various projects.

Length: 8.965 mm

Short length of 8.965 mm further contributes to space-saving design, ensuring efficient use of PCB real estate.

Technology: ECL

ECL (Emitter-Coupled Logic) technology provides high-speed operation and low power consumption, making this digital arithmetic circuit energy-efficient and suitable for high-performance applications.

Terminal Form: J BEND

J bend terminal form offers reliable contact with the PCB, ensuring secure connections and enhancing the overall durability of the circuit.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this digital arithmetic circuit allows for precise soldering and alignment on the PCB, facilitating easy assembly.

Technical Specifications

Digital Arithmetic Circuits MC10165FNR2 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

10K

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.965 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

4 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10165FNR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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