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MC100E166FN

Onsemi

MC100E166FN by Onsemi

MC100E166FN by Onsemi is a 9-bit digital arithmetic circuit with 1.4ns propagation delay, operating b/w 0-85 °C. It features ECL technology, open-emitter output characteristics, and requires a supply voltage of 4.2-5.5V. Ideal for applications requiring fast arithmetic calculations in electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

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Digiode

USA . 1,230 parts In-Stock

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Vyrian

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Q Components

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ECAB

Sweden . 156 parts In-Stock

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Electro Mavin

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Prism Electronics

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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First Choice Components Inc.

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Kulean Microsystems

USA . 7,346 parts In-Stock

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SupplyDigital Components

Austria . 6,882 parts In-Stock

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Problanco Electronics

Mexico . 4,611 parts In-Stock

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TANS Electronics

Latvia . 4,293 parts In-Stock

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Corphita

USA . 1,109 parts In-Stock

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UHIMA Technologies

Türkiye . 288 parts In-Stock

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Corohmni

South Africa . 164 parts In-Stock

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Kepictronics

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Perfect Parts

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Assy Fe

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Overview

Unlock the power of precision and speed with the MC100E166FN by Onsemi. Crafted with expertise and reliability, this digital arithmetic circuit offers unmatched performance in a square package body material. Ideal for a wide range of applications, this chip carrier is designed for seamless integration into your projects. Experience fast propagation delay, open-emitter output characteristics, and true output polarity. Elevate your designs with the quality and value that only Onsemi can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the circuit board.

No. of Bits: 9

The 9-bit design allows for higher precision in arithmetic calculations.

Nominal Supply Voltage / Vsup (V): 5

A stable supply voltage of 5V ensures consistent performance of the circuit.

Propagation Delay (tpd): 1.4 ns

The low propagation delay enables high-speed operation, making the product suitable for real-time arithmetic calculations.

Output Characteristics: OPEN-EMITTER

Open-emitter output allows for flexibility in connecting the circuit to other components or systems.

Technology: ECL

ECL technology offers high speed and low power consumption, making the product energy-efficient and suitable for high-performance applications.

Technical Specifications

Digital Arithmetic Circuits MC100E166FN attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.5V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Logic IC Type:

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Propagation Delay (tpd):

1.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100E166FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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