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MC10H159M

Onsemi

MC10H159M by Onsemi

MC10H159M by Onsemi is a 4-function, 2-input multiplexer with propagation delay of 3.2 ns at 75 °C. It features ECL technology, operates b/w 0-75°C, and has a small outline package style. Ideal for high-speed signal switching applications in commercial electronics.

Median Price

$3.476

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,100 parts In-Stock

1+ parts

-

100+ parts

$3.090

1k+ parts

$2.760

10k+ parts

$2.600

7,100

-

$3.090

$2.760

$2.600

Verical

USA . 7,100 parts In-Stock

1+ parts

-

100+ parts

$3.862

1k+ parts

$3.450

10k+ parts

-

7,100

-

$3.862

$3.450

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 470 parts In-Stock

1+ parts

$3.278

100+ parts

-

1k+ parts

-

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-

470

$3.278

-

-

-

Vyrian

USA . 9,093 parts In-Stock

1+ parts

-

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-

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9,093

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 265 parts In-Stock

1+ parts

$2.980

100+ parts

-

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-

10k+ parts

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265

$2.980

-

-

-

Corphita

USA . 1,618 parts In-Stock

1+ parts

$3.105

100+ parts

-

1k+ parts

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-

1,618

$3.105

-

-

-

AZTECH Wire

Italy . 94 parts In-Stock

1+ parts

$18.120

100+ parts

-

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94

$18.120

-

-

-

Continental Prestige Electronics

USA . 7,100 parts In-Stock

1+ parts

-

100+ parts

$2.980

1k+ parts

-

10k+ parts

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7,100

-

$2.980

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Problanco Electronics

Mexico . 6,514 parts In-Stock

1+ parts

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100+ parts

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6,514

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TANS Electronics

Latvia . 4,508 parts In-Stock

1+ parts

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4,508

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SupplyDigital Components

Austria . 4,183 parts In-Stock

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4,183

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Kulean Microsystems

USA . 2,740 parts In-Stock

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2,740

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UHIMA Technologies

Türkiye . 806 parts In-Stock

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806

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Microchip USA

USA . 124 parts In-Stock

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124

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Overview

Experience the superior quality and reliability of Onsemi with the MC10H159M multiplexer & demultiplexer. This innovative product offers unparalleled performance and efficiency, making it the perfect choice for a wide range of applications. With 4 functions, 2 inputs, and a fast propagation delay of 3.2 ns, this device is designed to deliver exceptional results in commercial extended temperature environments. Trust Onsemi to provide cutting-edge technology and unmatched value, ensuring your projects are always ahead of the curve. Elevate your designs with the MC10H159M and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 3.2 ns

Fast propagation delay allows for efficient data transmission within the multiplexer/demultiplexer.

Surface Mount: YES

Ease of installation and PCB integration, making it suitable for various electronic applications.

No. of Functions: 4

Enables the multiplexer/demultiplexer to handle multiple data streams simultaneously, increasing its versatility.

No. of Inputs: 2

Allows for flexibility in input sources and compatibility with different systems.

Package Shape: RECTANGULAR

Compact design for efficient use of space on the PCB.

No. of Terminals: 16

Sufficient number of terminals for connectivity and signal transfer within the device.

Propagation Delay (tpd): 2.2 ns

Low propagation delay ensures fast data processing and minimal latency in data transmission.

Maximum Operating Temperature: 75 °C

Wide temperature range allows for reliable operation in various environmental conditions.

Minimum Operating Temperature: 0 °C

Suitable for use in both low and high-temperature environments, ensuring consistent performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and excellent conductivity for reliable signal transmission.

Terminal Position: DUAL

Dual terminal position for enhanced stability and secure connection on the PCB.

Width: 5.275 mm

Compact width for space-saving installation and efficient PCB layout.

Output Polarity: INVERTED

Allows for signal inversion as needed in specific applications, providing flexibility in signal processing.

Temperature Grade: COMMERCIAL EXTENDED

Suitable for both commercial and extended temperature range applications, increasing the product's versatility.

Moisture Sensitivity Level (MSL): 3

Moderate MSL rating ensures the product can withstand typical moisture exposure during handling and storage.

Technical Specifications

Multiplexer & Demultiplexer MC10H159M attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

58 mA

Propagation Delay At Nominal Supply:

3.2 ns

Propagation Delay (tpd):

2.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H159M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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