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MC10H117M

Onsemi

MC10H117M by Onsemi

MC10H117M by Onsemi is a Logic Gates IC with 1.5ns Propagation Delay, -5.2V Nominal Voltage, and ECL Technology. It has 2 functions and 5 inputs, suitable for high-speed applications requiring fast signal processing in commercial electronics. The small outline package with gull wing terminals makes it ideal for surface mount PCB designs.

Median Price

$1.490

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 109 parts In-Stock

1+ parts

-

100+ parts

$1.490

1k+ parts

$1.240

10k+ parts

$1.100

109

-

$1.490

$1.240

$1.100

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,518 parts In-Stock

1+ parts

$1.159

100+ parts

-

1k+ parts

-

10k+ parts

-

1,518

$1.159

-

-

-

Vyrian

USA . 8,415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,415

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,254 parts In-Stock

1+ parts

$0.124

100+ parts

-

1k+ parts

$0.119

10k+ parts

$0.119

4,254

$0.124

-

$0.119

$0.119

Corphita

USA . 372 parts In-Stock

1+ parts

$1.098

100+ parts

-

1k+ parts

-

10k+ parts

-

372

$1.098

-

-

-

Corohmni

South Africa . 95 parts In-Stock

1+ parts

$1.220

100+ parts

-

1k+ parts

-

10k+ parts

-

95

$1.220

-

-

-

AZTECH Wire

Italy . 1,176 parts In-Stock

1+ parts

$18.300

100+ parts

-

1k+ parts

-

10k+ parts

-

1,176

$18.300

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 9,133 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,133

-

-

-

-

SupplyDigital Components

Austria . 7,077 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,077

-

-

-

-

Problanco Electronics

Mexico . 6,472 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,472

-

-

-

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Kulean Microsystems

USA . 4,805 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,805

-

-

-

-

TANS Electronics

Latvia . 3,193 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,193

-

-

-

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UHIMA Technologies

Türkiye . 350 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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350

-

-

-

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Microchip USA

USA . 120 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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120

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Overview

Unlock the power of high-performance logic gates with the MC10H117M by Onsemi. Designed with precision and quality in mind, this product offers unmatched reliability and efficiency for a wide range of applications. With its advanced technology and innovative design, customers can expect fast propagation delay and seamless integration. Say goodbye to delays and hello to seamless operations with the MC10H117M. Experience the difference with Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 1.5 ns

The fast propagation delay ensures quick response times in processing signals, making this product efficient for high-speed operations.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing the need for additional components.

No. of Functions: 2

Having multiple functions in one component can streamline circuit design, reduce complexity, and improve overall system efficiency.

No. of Inputs: 5

With a high number of inputs, this product can handle multiple input signals simultaneously, making it versatile for various logic operations.

Nominal Supply Voltage / Vsup (V): -5.2

The specified voltage range ensures compatibility with standard power supplies, making integration into existing systems easier.

No. of Terminals: 16

The ample number of terminals allows for flexible connections and enables the product to interface with other components in the circuit effectively.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the circuit board, ideal for compact designs or when board real estate is limited.

Propagation Delay (tpd): 1.35 ns

The low propagation delay further enhances the speed and efficiency of signal processing, critical for high-performance applications.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature ensures reliability and stability in various environmental conditions, making this product suitable for a wide range of applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function even in colder environments, adding to its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable and long-lasting connections.

Terminal Position: DUAL

Dual terminal positions offer flexibility in mounting the component on the board, allowing for different orientations to suit the design requirements.

Maximum Seated Height: 2.05 mm

The low seated height contributes to a slim profile, which is advantageous for applications where space constraints are a concern.

Width: 5.275 mm

The compact width of the product enables efficient use of board space, especially in densely populated circuit layouts.

Minimum Supply Voltage (Vsup): -4.94 V

The specified minimum supply voltage ensures the product operates within safe voltage limits, protecting it from potential damage or malfunction.

Peak Reflow Temperature °C: 260

The high reflow temperature tolerance simplifies the assembly process and ensures the component can withstand the necessary heat during soldering.

Length: 10.2 mm

The moderate length of the product allows for efficient placement on the board and contributes to overall compactness of the circuit design.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade indicates that the product can operate reliably in a wide range of temperature conditions commonly found in commercial settings.

Technology: ECL

ECL technology offers high speed and low power consumption, making this product suitable for applications requiring fast signal processing and energy efficiency.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy surface mounting and ensures reliable solder connections, contributing to overall product reliability.

Packing Method: RAIL

The rail packing method simplifies handling, storage, and assembly processes, making it convenient for manufacturers and designers.

Terminal Pitch: 1.27 mm

The tight terminal pitch allows for compact placement on the board and supports high-density circuit designs, maximizing board space utilization.

Moisture Sensitivity Level (MSL): 3

The moderate moisture sensitivity level indicates the component can withstand typical levels of moisture exposure during handling and assembly.

Maximum Supply Voltage (Vsup): -5.46 V

The specified maximum supply voltage ensures the product is protected from voltage spikes or overloads, contributing to its long-term reliability.

Technical Specifications

Logic Gates MC10H117M attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Inputs:

5

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Propagation Delay At Nominal Supply:

1.5 ns

Propagation Delay (tpd):

1.35 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H117M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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