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MC10H101MG

Onsemi

MC10H101MG by Onsemi

MC10H101MG by Onsemi is a logic gate with 4 functions and 2 inputs. It has a propagation delay of 1.6 ns at -5.2V, suitable for high-speed applications in commercial electronics due to its ECL technology and small outline package style.

Median Price

$2.190

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$2.190

1k+ parts

$1.960

10k+ parts

$1.850

10

-

$2.190

$1.960

$1.850

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,508 parts In-Stock

1+ parts

$2.328

100+ parts

-

1k+ parts

-

10k+ parts

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1,508

$2.328

-

-

-

Chip Stock

USA . 62,000 parts In-Stock

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62,000

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Vyrian

USA . 5,484 parts In-Stock

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5,484

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ComSIT Distribution GmbH

Germany . 350 parts In-Stock

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350

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ACDS - Activité Composants Distribution Service

France . 150 parts In-Stock

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150

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Zilex Electronics Inc.

Canada . 50 parts In-Stock

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50

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Distributors (Availability)

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Corphita

USA . 2,353 parts In-Stock

1+ parts

$2.205

100+ parts

-

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2,353

$2.205

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Corohmni

South Africa . 125 parts In-Stock

1+ parts

$2.450

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125

$2.450

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AZTECH Wire

Italy . 176 parts In-Stock

1+ parts

$21.340

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176

$21.340

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Component Stockers USA

USA . 713 parts In-Stock

1+ parts

$99.990

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713

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 7,027 parts In-Stock

1+ parts

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7,027

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Problanco Electronics

Mexico . 4,781 parts In-Stock

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4,781

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TANS Electronics

Latvia . 4,241 parts In-Stock

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4,241

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SupplyDigital Components

Austria . 4,027 parts In-Stock

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4,027

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Authorized Procurement Solutions

USA . 150 parts In-Stock

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150

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UHIMA Technologies

Türkiye . 132 parts In-Stock

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132

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Microchip USA

USA . 114 parts In-Stock

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114

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Kulean Microsystems

USA . 76 parts In-Stock

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76

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Overview

Enhance your electronic designs with the MC10H101MG logic gate from Onsemi, a leading manufacturer known for its high-quality components. This versatile product offers a fast propagation delay of 1.7 ns and is ideal for applications requiring precise timing and signal processing. With four functions and dual inputs, this compact rectangular package provides excellent performance in a wide range of commercial and extended temperature environments. Trust Onsemi's expertise and choose the MC10H101MG for your next project to experience reliable functionality and exceptional value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-term use.

Propagation Delay At Nominal Supply: 1.7 ns

With a low propagation delay, this product ensures fast signal processing and high-speed performance.

Surface Mount: YES

Being surface mountable, this product offers easy installation and saves space on the PCB.

No. of Functions: 4

Having multiple functions in a single component simplifies circuit design and reduces the number of components required.

No. of Inputs: 2

With 2 inputs, this product can perform logical operations on two binary inputs, enhancing versatility.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on the PCB and easy integration into existing designs.

Nominal Supply Voltage / Vsup (V): -5.2

The specified supply voltage ensures compatibility with standard power sources, making it easy to integrate into various systems.

No. of Terminals: 16

With 16 terminals, this product offers flexibility in connectivity and compatibility with a wide range of circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and is suitable for compact electronic devices.

Propagation Delay (tpd): 1.6 ns

The low propagation delay ensures minimal signal distortion and fast response times, crucial for high-speed applications.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature allows the product to work reliably in various environmental conditions.

Minimum Operating Temperature: 0 °C

The wide operating temperature range ensures the product can function in both extreme cold and hot environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Having dual terminal positions allows for versatile mounting options and ease of connection in different circuit layouts.

Maximum Seated Height: 2.05 mm

The low seated height makes this product suitable for compact electronic devices and applications with space constraints.

Width: 5.275 mm

The narrow width of the product enables efficient use of PCB real estate and allows for dense circuit designs.

Minimum Supply Voltage (Vsup): -4.94 V

The specified minimum supply voltage ensures proper functionality and performance even under low power conditions.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering during assembly processes.

Length: 10.2 mm

The compact length of the product facilitates space-saving on the PCB and enables efficient circuit layouts.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade ensures reliable performance in industrial applications with varying temperature conditions.

Technology: ECL

ECL technology used in this product offers high-speed operation and low power consumption, ideal for critical applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections and ease of handling during PCB assembly.

Packing Method: RAIL

The rail packing method offers convenient handling and storage of multiple units during production and transportation.

Terminal Pitch: 1.27 mm

The specified terminal pitch allows for precise placement on the PCB and facilitates seamless integration into circuit designs.

Maximum Supply Voltage (Vsup): -5.46 V

The specified maximum supply voltage ensures safety and prevents damage to the product in case of voltage fluctuations.

Maximum Power Supply Current (ICC): 29 mA

The low power supply current requirement indicates energy efficiency and reduced power consumption for cost-effective operation.

Technical Specifications

Logic Gates MC10H101MG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

29 mA

Propagation Delay At Nominal Supply:

1.7 ns

Propagation Delay (tpd):

1.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H101MG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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