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MC10EP57DTR2

Onsemi

MC10EP57DTR2 by Onsemi

MC10EP57DTR2 by Onsemi is a 4-input multiplexer with 0.52 ns propagation delay at 3.3V. It operates in industrial temperature range (-40 to 85 °C) and supports ECL technology. Ideal for high-speed signal switching applications due to its low delay and complementary output polarity.

Median Price

$4.174

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,250 parts In-Stock

1+ parts

-

100+ parts

$3.710

1k+ parts

$3.320

10k+ parts

$3.130

2,250

-

$3.710

$3.320

$3.130

Verical

USA . 2,250 parts In-Stock

1+ parts

-

100+ parts

$4.638

1k+ parts

$4.150

10k+ parts

$3.913

2,250

-

$4.638

$4.150

$3.913

Distributors (In-Stock)

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Digiode

USA . 1,271 parts In-Stock

1+ parts

$3.933

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1,271

$3.933

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Vyrian

USA . 7,554 parts In-Stock

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7,554

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Electronics Depot

USA . 21 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Corohmni

South Africa . 185 parts In-Stock

1+ parts

$3.660

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-

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185

$3.660

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Corphita

USA . 1,668 parts In-Stock

1+ parts

$3.726

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1,668

$3.726

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AZTECH Wire

Italy . 358 parts In-Stock

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$17.410

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358

$17.410

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$31.972

100+ parts

$29.095

1k+ parts

$26.217

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-

2,000

$31.972

$29.095

$26.217

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TANS Electronics

Latvia . 8,003 parts In-Stock

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Kulean Microsystems

USA . 7,276 parts In-Stock

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Problanco Electronics

Mexico . 6,879 parts In-Stock

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SupplyDigital Components

Austria . 2,584 parts In-Stock

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Continental Prestige Electronics

USA . 2,250 parts In-Stock

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$3.580

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UHIMA Technologies

Türkiye . 661 parts In-Stock

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Microchip USA

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Perfect Parts

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Overview

Upgrade your electronics with the MC10EP57DTR2 by Onsemi, a top-of-the-line multiplexer & demultiplexer offering unparalleled quality and reliability. Designed for industrial applications, this small outline, thin profile component boasts a swift propagation delay of just 0.52 ns, ensuring optimal performance. With Onsemi's cutting-edge technology and precision engineering, customers can trust in the superior value and benefits this product delivers. Stay ahead of the curve with the MC10EP57DTR2 - the perfect choice for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the multiplexer & demultiplexer.

Propagation Delay At Nominal Supply: 0.52 ns

Ensures high-speed signal processing for efficient data transmission.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying assembly.

No. of Inputs: 4

Offers versatility and flexibility in connecting multiple input sources.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a common voltage level, ensuring compatibility with other components.

Power Supplies (V): -5.2

Allows for different power supply options to meet specific system requirements.

No. of Terminals: 20

Provides ample connection points for input and output signals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Enables a compact and space-saving design for tight circuit layouts.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of operating conditions.

Minimum Operating Temperature: -40 °C

Suitable for use in both industrial and extreme temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and ensures stable electrical connections.

Terminal Position: DUAL

Facilitates easy installation and wiring in various orientations.

Width: 4.4 mm

Compact size for space-constrained applications.

Output Polarity: COMPLEMENTARY

Allows for easy signal processing and interpretation.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments and temperature fluctuations.

Technology: ECL

Utilizes Emitter-Coupled Logic for high-speed and low-power operation.

Technical Specifications

Multiplexer & Demultiplexer MC10EP57DTR2 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V;

Family:

10E

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

65 mA

Propagation Delay At Nominal Supply:

.52 ns

Propagation Delay (tpd):

.475 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC10EP57DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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