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MC10EL04DT

Onsemi

MC10EL04DT by Onsemi

MC10EL04DT by Onsemi is a Logic Gate with 0.37 ns Propagation Delay, 2 Inputs, and 5V Nominal Voltage. It operates in Industrial Temperature Grade ECL Technology for high-speed applications requiring precise signal timing. The package is small outline with thin profile suitable for surface mount assembly.

Median Price

$1.649

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,887 parts In-Stock

1+ parts

-

100+ parts

$1.560

1k+ parts

$1.390

10k+ parts

$1.310

2,887

-

$1.560

$1.390

$1.310

Verical

USA . 2,887 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.738

10k+ parts

$1.637

2,887

-

-

$1.738

$1.637

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,746 parts In-Stock

1+ parts

$1.644

100+ parts

-

1k+ parts

-

10k+ parts

-

1,746

$1.644

-

-

-

Vyrian

USA . 2,027 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

2,027

-

-

-

-

Bristol Electronics

USA . 42 parts In-Stock

1+ parts

-

100+ parts

$1.400

1k+ parts

-

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42

-

$1.400

-

-

Microfarads

USA . 40 parts In-Stock

1+ parts

-

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-

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40

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,260 parts In-Stock

1+ parts

$1.557

100+ parts

-

1k+ parts

-

10k+ parts

-

1,260

$1.557

-

-

-

Corohmni

South Africa . 172 parts In-Stock

1+ parts

$1.730

100+ parts

-

1k+ parts

-

10k+ parts

-

172

$1.730

-

-

-

Component Stockers USA

USA . 2,401 parts In-Stock

1+ parts

$1.790

100+ parts

$1.680

1k+ parts

$1.530

10k+ parts

-

2,401

$1.790

$1.680

$1.530

-

AZTECH Wire

Italy . 736 parts In-Stock

1+ parts

$20.020

100+ parts

-

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-

10k+ parts

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736

$20.020

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 29,110 parts In-Stock

1+ parts

-

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29,110

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Problanco Electronics

Mexico . 7,834 parts In-Stock

1+ parts

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7,834

-

-

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TANS Electronics

Latvia . 6,965 parts In-Stock

1+ parts

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6,965

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SupplyDigital Components

Austria . 5,943 parts In-Stock

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5,943

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Microchip USA

USA . 5,041 parts In-Stock

1+ parts

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5,041

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Kulean Microsystems

USA . 4,560 parts In-Stock

1+ parts

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4,560

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Continental Prestige Electronics

USA . 2,887 parts In-Stock

1+ parts

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100+ parts

$1.510

1k+ parts

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10k+ parts

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2,887

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$1.510

-

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Metaverse IC Inc.

Canada . 1,075 parts In-Stock

1+ parts

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100+ parts

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1,075

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-

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UHIMA Technologies

Türkiye . 308 parts In-Stock

1+ parts

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308

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Overview

Unleash the power of precision with the MC10EL04DT by Onsemi. Crafted with cutting-edge technology and industrial-grade quality, this logic gate offers lightning-fast propagation delay at nominal supply, making it perfect for applications that demand speed and accuracy. Whether you're designing high-performance computing systems or advanced telecommunications networks, this small outline, thin profile package delivers unmatched efficiency and reliability. Elevate your projects with the MC10EL04DT and experience unparalleled performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for applications requiring portability and reliability.

Propagation Delay At Nominal Supply: 0.41 ns

The low propagation delay ensures fast processing speed, making this logic gate suitable for high-speed circuit applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and simplifying production processes.

Nominal Supply Voltage: 5V

Operates at a standard supply voltage of 5V, compatible with most common logic circuit configurations.

Maximum Operating Temperature: 85 °C

With a high operating temperature range of up to 85 °C, this logic gate can withstand harsh environmental conditions and maintain performance.

Technology: ECL

ECL technology offers high-speed and high-performance operation, making this logic gate suitable for demanding applications that require precise timing and reliability.

Technical Specifications

Logic Gates MC10EL04DT attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

10EL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

17 mA

Propagation Delay At Nominal Supply:

.41 ns

Propagation Delay (tpd):

.37 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

MC10EL04DT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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