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MC100EP105FA

Onsemi

MC100EP105FA by Onsemi

AND/NAND GATE; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;

Median Price

$6.738

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,051 parts In-Stock

1+ parts

-

100+ parts

$5.990

1k+ parts

$5.360

10k+ parts

$5.050

8,051

-

$5.990

$5.360

$5.050

Verical

USA . 4,701 parts In-Stock

1+ parts

-

100+ parts

$7.487

1k+ parts

$6.700

10k+ parts

$6.313

4,701

-

$7.487

$6.700

$6.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 170 parts In-Stock

1+ parts

$6.336

100+ parts

-

1k+ parts

-

10k+ parts

-

170

$6.336

-

-

-

Freelance Electronics

USA . 9 parts In-Stock

1+ parts

$9.876

100+ parts

$10.370

1k+ parts

$9.778

10k+ parts

-

9

$9.876

$10.370

$9.778

-

Vyrian

USA . 8,889 parts In-Stock

1+ parts

-

100+ parts

-

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8,889

-

-

-

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Component Sense

UK . 250 parts In-Stock

1+ parts

-

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-

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250

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-

-

-

Sensible Micro Corp

USA . 36 parts In-Stock

1+ parts

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36

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-

-

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EMSNET

USA . 22 parts In-Stock

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-

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22

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R&J Components

USA . 12 parts In-Stock

1+ parts

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12

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Semi Source

USA . 7 parts In-Stock

1+ parts

-

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-

1k+ parts

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7

-

-

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Speed Components Ltd

Israel . 6 parts In-Stock

1+ parts

-

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6

-

-

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Sunrise Surplus Inc.

USA . 1 parts In-Stock

1+ parts

-

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1

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 858 parts In-Stock

1+ parts

$6.003

100+ parts

-

1k+ parts

-

10k+ parts

-

858

$6.003

-

-

-

Corohmni

South Africa . 347 parts In-Stock

1+ parts

$6.670

100+ parts

-

1k+ parts

-

10k+ parts

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347

$6.670

-

-

-

Component Stockers USA

USA . 5,195 parts In-Stock

1+ parts

$6.820

100+ parts

$6.410

1k+ parts

$5.800

10k+ parts

-

5,195

$6.820

$6.410

$5.800

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Ampacity Inc.

Singapore . 7,655 parts In-Stock

1+ parts

$12.340

100+ parts

-

1k+ parts

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10k+ parts

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7,655

$12.340

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-

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AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$14.550

100+ parts

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559

$14.550

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-

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Continental Prestige Electronics

USA . 8,061 parts In-Stock

1+ parts

-

100+ parts

$5.790

1k+ parts

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10k+ parts

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8,061

-

$5.790

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Problanco Electronics

Mexico . 7,350 parts In-Stock

1+ parts

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7,350

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SupplyDigital Components

Austria . 7,039 parts In-Stock

1+ parts

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7,039

-

-

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Kulean Microsystems

USA . 3,618 parts In-Stock

1+ parts

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3,618

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TANS Electronics

Latvia . 2,832 parts In-Stock

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2,832

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UHIMA Technologies

Türkiye . 314 parts In-Stock

1+ parts

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314

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Microchip USA

USA . 276 parts In-Stock

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276

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Technical Specifications

Logic Gates MC100EP105FA attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e0

Length:

7 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Packing Method:

TRAY

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

85 mA

Propagation Delay At Nominal Supply:

375 ns

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.6 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

MC100EP105FA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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