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LC89075WA-H

Onsemi

LC89075WA-H by Onsemi

LC89075WA-H by Onsemi is a 64-terminal IC with power supplies of 3.3V and 5V, suitable for consumer circuit applications. It features a flatpack, low profile package style with a terminal pitch of 0.5mm. Operating temperature ranges from -30 to 85 °C, making it ideal for various electronic devices.

Median Price

$1.760

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,659 parts In-Stock

1+ parts

-

100+ parts

$1.760

1k+ parts

$1.570

10k+ parts

$1.480

1,659

-

$1.760

$1.570

$1.480

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 946 parts In-Stock

1+ parts

$1.976

100+ parts

-

1k+ parts

-

10k+ parts

-

946

$1.976

-

-

-

Vyrian

USA . 3,531 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,531

-

-

-

-

Flip Electronics

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

800

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 95 parts In-Stock

1+ parts

$1.872

100+ parts

-

1k+ parts

-

10k+ parts

-

95

$1.872

-

-

-

Corohmni

South Africa . 295 parts In-Stock

1+ parts

$2.080

100+ parts

-

1k+ parts

-

10k+ parts

-

295

$2.080

-

-

-

AZTECH Wire

Italy . 765 parts In-Stock

1+ parts

$13.970

100+ parts

-

1k+ parts

-

10k+ parts

-

765

$13.970

-

-

-

Problanco Electronics

Mexico . 5,753 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,753

-

-

-

-

Kulean Microsystems

USA . 5,402 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,402

-

-

-

-

SupplyDigital Components

Austria . 2,456 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,456

-

-

-

-

TANS Electronics

Latvia . 2,153 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,153

-

-

-

-

Kepictronics

USA . 800 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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800

-

-

-

-

Microchip USA

USA . 266 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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266

-

-

-

-

UHIMA Technologies

Türkiye . 241 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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241

-

-

-

-

Overview

Enhance your consumer electronic products with the LC89075WA-H by Onsemi. Crafted with precision and quality, this innovative IC offers unmatched performance and reliability. From smart home devices to wearable technology, this versatile product is perfect for a wide range of applications. Experience the value and benefits of Onsemi's cutting-edge technology, providing superior functionality and efficiency to meet your needs. Upgrade your designs with the LC89075WA-H and stay ahead in the competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, suitable for consumer electronics applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and cost in manufacturing.

Package Shape: SQUARE

The square package shape is space-efficient and provides a stable mounting surface on the PCB.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Other Function Consumer ICs LC89075WA-H attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 3 TO 3.6 DIGITAL V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e6

Length:

10 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

40 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

LC89075WA-H General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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