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LC89561-3181

Onsemi

LC89561-3181 by Onsemi

The Onsemi LC89561-3181 is a consumer IC with 100 terminals in a square flatpack package. Operating temperature ranges from -30 °C to 70°C, suitable for various consumer circuit applications. It operates at 5V power supply and utilizes CMOS technology with gull wing terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,314 parts In-Stock

1+ parts

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100+ parts

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1,314

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Vyrian

USA . 903 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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903

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 4,116 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,116

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TANS Electronics

Latvia . 3,001 parts In-Stock

1+ parts

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1k+ parts

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3,001

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SupplyDigital Components

Austria . 2,511 parts In-Stock

1+ parts

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100+ parts

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2,511

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Corphita

USA . 2,113 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,113

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UHIMA Technologies

Türkiye . 799 parts In-Stock

1+ parts

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799

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Corohmni

South Africa . 227 parts In-Stock

1+ parts

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100+ parts

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227

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Problanco Electronics

Mexico . 102 parts In-Stock

1+ parts

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100+ parts

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102

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Overview

Experience superior quality and reliability with the LC89561-3181 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers exceptional products that exceed expectations. This versatile consumer IC offers a wide range of applications, providing value and benefits to customers looking for high-performance solutions. From its durable plastic/epoxy package body to its advanced technology and impressive operating temperature range, the LC89561-3181 is the perfect choice for your electronic projects. Trust Onsemi to deliver innovation and excellence in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the integrated circuits inside, making this product long-lasting and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and simplifying the manufacturing process.

Package Shape: SQUARE

The square package shape is compact and space-efficient, making it suitable for applications where size constraints are important.

Power Supplies (V): 5

A standard power supply voltage of 5V ensures compatibility with common power sources and simplifies integration into existing systems.

No. of Terminals: 100

With a high number of terminals, this product offers versatility and flexibility in connecting to various components and peripherals.

Package Style (Meter): FLATPACK

The flatpack package style is low profile, making it suitable for applications where space is limited and height restrictions apply.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable performance in a wide range of environmental conditions, enhancing the product's robustness.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature ensures that the product can function effectively even in extreme cold environments, expanding its range of use.

Terminal Position: QUAD

Quad terminal positioning facilitates easier soldering and connections, improving the overall efficiency and reliability of the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering, ensuring secure connections and enhancing the product's overall durability.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting on the PCB, enabling more compact and efficient designs for electronic devices.

Technical Specifications

Other Function Consumer ICs LC89561-3181 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G100

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC89561-3181 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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