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LC895196K

Onsemi

LC895196K by Onsemi

LC895196K by Onsemi is a consumer circuit IC with 144 terminals in a square flatpack package. Operating temperature ranges from -30 °C to 70°C, suitable for various applications. It features a power supply of 5V and utilizes CMOS technology for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,238 parts In-Stock

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2,238

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Digiode

USA . 1,326 parts In-Stock

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1,326

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,781 parts In-Stock

1+ parts

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7,781

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SupplyDigital Components

Austria . 7,700 parts In-Stock

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7,700

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Problanco Electronics

Mexico . 1,973 parts In-Stock

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1,973

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UHIMA Technologies

Türkiye . 943 parts In-Stock

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943

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TANS Electronics

Latvia . 492 parts In-Stock

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492

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Corohmni

South Africa . 251 parts In-Stock

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251

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Corphita

USA . 170 parts In-Stock

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170

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Overview

Unleash the power of innovation with the LC895196K by Onsemi. Crafted with precision and expertise, this consumer circuit IC offers unparalleled quality and reliability for a wide range of applications. From smart home devices to automotive electronics, this versatile component delivers exceptional performance and efficiency. Experience the value of cutting-edge technology and seamless integration with the LC895196K, your ultimate solution for all your electronic needs. Trust in Onsemi's legacy of excellence and unlock endless possibilities with this state-of-the-art product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the internal components of the IC, ensuring reliability and durability.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and cost in production.

Package Shape: SQUARE

SQUARE package shape is commonly used for consumer ICs, providing easy handling and efficient PCB layout.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics applications, ensuring compatibility and performance in a wide range of devices.

Power Supplies (V): 5

Operates at a standard voltage of 5V, making it compatible with a variety of electronic systems and power sources.

No. of Terminals: 144

Higher number of terminals allow for more versatile connections and functionalities within the circuit design.

Package Style (Meter): FLATPACK

FLATPACK package style offers a compact and space-saving design, ideal for consumer electronics with limited space.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and extended operation.

Minimum Operating Temperature: -30 °C

Wide temperature range ensures reliable performance in both extreme cold and hot conditions, making it suitable for various applications.

Terminal Position: QUAD

QUAD terminal position provides stable and secure connections, reducing the risk of signal loss or interference.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making this IC energy efficient and fast.

Terminal Form: GULL WING

GULL WING terminal form is commonly used in surface mount components, allowing for easy soldering and installation on PCBs.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high density packaging, increasing the functionality and integration capabilities of the IC.

Technical Specifications

Other Function Consumer ICs LC895196K attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G144

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC895196K General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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