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LC895195

Onsemi

LC895195 by Onsemi

The Onsemi LC895195 is a consumer circuit IC with 144 terminals in a square flatpack package. Operating temperature ranges from -30 °C to 70°C, suitable for various applications. It utilizes CMOS technology and has a power supply of 5V, making it ideal for consumer electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,283 parts In-Stock

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Digiode

USA . 543 parts In-Stock

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543

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Kulean Microsystems

USA . 7,794 parts In-Stock

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SupplyDigital Components

Austria . 7,582 parts In-Stock

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TANS Electronics

Latvia . 7,545 parts In-Stock

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Problanco Electronics

Mexico . 5,134 parts In-Stock

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Corphita

USA . 937 parts In-Stock

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UHIMA Technologies

Türkiye . 532 parts In-Stock

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Corohmni

South Africa . 428 parts In-Stock

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Overview

Elevate your consumer electronics with the LC895195 by Onsemi. Known for their top-notch quality and innovative technology, Onsemi delivers cutting-edge solutions for a wide range of applications. The LC895195 offers unmatched value and benefits, providing customers with reliable performance and seamless integration. Explore new possibilities and enhance your products with this versatile IC, designed to exceed expectations and elevate user experiences. Choose Onsemi for superior quality and exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides good insulation and protection for the internal components of the IC, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology makes installation and replacement of the IC easier and more efficient, reducing production time and costs.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB space and easy alignment during assembly.

Power Supplies (V): 5

Standard 5V power supply makes this IC compatible with a wide range of electronic devices and systems.

No. of Terminals: 144

Large number of terminals provide flexibility in connecting the IC to other components and peripherals.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows the IC to be used in a variety of environments without risking overheating or malfunction.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature ensures the IC can still function reliably in cold environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the IC energy efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure connections, improving the overall performance and lifespan of the IC.

Terminal Pitch: 0.5 mm

Small terminal pitch provides high packing density, allowing for more terminals to be placed on the IC and enabling more functionality in a smaller space.

Technical Specifications

Other Function Consumer ICs LC895195 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G144

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC895195 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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