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LC89057W-VF4

Onsemi

LC89057W-VF4 by Onsemi

LC89057W-VF4 by Onsemi is a 48-terminal CMOS IC with a power supply of 3.3V, operating b/w -30 °C to 70°C. It comes in a square-shaped plastic/epoxy package and is surface-mountable, suitable for consumer circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,232 parts In-Stock

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Vyrian

USA . 772 parts In-Stock

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SupplyDigital Components

Austria . 8,399 parts In-Stock

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TANS Electronics

Latvia . 7,333 parts In-Stock

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Kulean Microsystems

USA . 7,034 parts In-Stock

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Problanco Electronics

Mexico . 5,839 parts In-Stock

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Corphita

USA . 2,090 parts In-Stock

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UHIMA Technologies

Türkiye . 386 parts In-Stock

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Corohmni

South Africa . 166 parts In-Stock

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Kepictronics

USA . 96 parts In-Stock

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Overview

Elevate your consumer electronic designs with the LC89057W-VF4 by Onsemi. Crafted with precision and expertise, this versatile consumer circuit IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides seamless integration and superior performance. Experience the value and benefits of Onsemi's cutting-edge technology, providing customers with innovative solutions that exceed expectations. Explore the endless possibilities with the LC89057W-VF4 and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection to the internal circuitry, making the product long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the IC onto a printed circuit board, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape helps in efficient use of space on the PCB, allowing for more components to be placed in a compact area.

Power Supplies (V): 3.3

The 3.3V power supply is commonly used in consumer electronics, making this IC suitable for a wide range of applications in this category.

No. of Terminals: 48

Having 48 terminals allows for more connections and functionalities to be integrated into the IC, making it versatile and customizable.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile design, which is ideal for space-constrained applications or when a slim form factor is required.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the IC can function efficiently even under elevated temperatures, ensuring reliability in various environments.

Minimum Operating Temperature: -30 °C

The ability to operate at a minimum temperature of -30 °C makes this IC suitable for use in cold environments without risking performance or functionality.

Terminal Position: QUAD

The quad terminal position allows for easy soldering and connection of the IC to the PCB, simplifying the assembly process.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high noise immunity, and compatibility with various digital systems.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and stability to the connections, reducing the risk of damage during handling or operation.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, the IC can accommodate densely packed PCB layouts, enabling high-density integration of components for better performance.

Technical Specifications

Other Function Consumer ICs LC89057W-VF4 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC89057W-VF4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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