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LC895127K

Onsemi

LC895127K by Onsemi

LC895127K by Onsemi is a consumer circuit IC with 144 terminals in a flatpack package. Operating temperature ranges from -30 °C to 70°C, suitable for various applications. It features a power supply of 5V and utilizes CMOS technology for efficient performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,207 parts In-Stock

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Digiode

USA . 2,008 parts In-Stock

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2,008

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Kulean Microsystems

USA . 6,254 parts In-Stock

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SupplyDigital Components

Austria . 5,545 parts In-Stock

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TANS Electronics

Latvia . 4,919 parts In-Stock

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Corphita

USA . 2,379 parts In-Stock

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Problanco Electronics

Mexico . 2,060 parts In-Stock

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Corohmni

South Africa . 444 parts In-Stock

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UHIMA Technologies

Türkiye . 132 parts In-Stock

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Overview

Unlock the potential of your consumer electronics with the LC895127K by Onsemi. Known for their high-quality manufacturing, Onsemi delivers reliable products that exceed industry standards. This versatile IC is ideal for a wide range of applications, offering customers unparalleled value and performance. Whether you're designing cutting-edge gadgets or upgrading existing devices, the LC895127K will enhance functionality and efficiency, making it a must-have for any tech enthusiast. Elevate your projects with Onsemi's innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and resistance to impact, making the product suitable for consumer applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and making assembly more efficient.

Package Shape: SQUARE

The square package shape makes the product easy to handle and provides a compact form factor for space-constrained applications.

Power Supplies (V): 5

Operating at 5 volts provides a common power supply requirement, making it compatible with a wide range of systems and devices.

No. of Terminals: 144

Having a high number of terminals allows for versatile connectivity options and enables the product to support complex functionalities.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the product can withstand moderate heat conditions, ensuring reliable performance.

Minimum Operating Temperature: -30 °C

The product can operate in cold temperatures as low as -30 °C, making it suitable for a wide range of environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections and facilitates easy PCB mounting, ensuring robust electrical connections.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density packaging, enabling more components to be placed on the circuit board, increasing functionality within a limited space.

Technical Specifications

Other Function Consumer ICs LC895127K attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G144

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC895127K General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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