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LC895299W

Onsemi

LC895299W by Onsemi

The Onsemi LC895299W is a consumer IC with 176 terminals, operating at temperatures from 0 to 70 °C. It features power supplies of 3.3V and 5V, suitable for various consumer circuit applications. This CMOS technology device comes in a square-shaped plastic/epoxy package with surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,297 parts In-Stock

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2,297

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Digiode

USA . 1,243 parts In-Stock

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1,243

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Distributors (Availability)

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Problanco Electronics

Mexico . 8,342 parts In-Stock

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8,342

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TANS Electronics

Latvia . 7,140 parts In-Stock

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7,140

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Kulean Microsystems

USA . 6,880 parts In-Stock

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6,880

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SupplyDigital Components

Austria . 5,073 parts In-Stock

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5,073

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Corohmni

South Africa . 492 parts In-Stock

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492

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Corphita

USA . 486 parts In-Stock

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UHIMA Technologies

Türkiye . 146 parts In-Stock

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Overview

Enhance your consumer electronic designs with the LC895299W by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in all their products. This versatile IC belongs to the Other Function Consumer ICs category, making it suitable for a wide range of applications. With its advanced technology and commercial-grade temperature tolerance, this IC offers exceptional value and benefits to customers looking for superior performance and efficiency in their electronics projects. Experience the advantages of the LC895299W and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good protection for the IC and ensures durability, making it suitable for consumer applications.

Surface Mount: YES

Surface mount technology allows for easy installation on PCBs, saving space and reducing production costs.

Package Shape: SQUARE

Square packages are compact and provide efficient use of board space, making the IC ideal for small electronic devices.

Power Supplies (V): 3.3,5

The IC supports multiple power supply options, providing flexibility for different design requirements.

No. of Terminals: 176

Having a high number of terminals allows for connectivity to a variety of components, enhancing the functionality of the IC.

Maximum Operating Temperature: 70 °C

The IC can operate at relatively high temperatures, ensuring reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, the IC can function effectively in both cold and hot environments.

Temperature Grade: COMMERCIAL

Commercial grade components are suitable for most consumer applications, providing a cost-effective solution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals are easy to solder onto PCBs, ensuring secure connections for stable circuit operation.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for densely packed components on the PCB, enabling a compact design for the electronic device.

Technical Specifications

Other Function Consumer ICs LC895299W attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G176

No. of Terminals:

176

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC895299W General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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