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LC895127

Onsemi

LC895127 by Onsemi

The Onsemi LC895127 is a consumer circuit IC with 144 terminals in a square flatpack package. Operating temperature ranges from -30 °C to 70°C, suitable for various applications. With CMOS technology and 5V power supply, it is ideal for surface mount consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,593 parts In-Stock

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Vyrian

USA . 464 parts In-Stock

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464

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Kulean Microsystems

USA . 4,511 parts In-Stock

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4,511

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Corphita

USA . 1,784 parts In-Stock

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1,784

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SupplyDigital Components

Austria . 840 parts In-Stock

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840

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Problanco Electronics

Mexico . 519 parts In-Stock

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519

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UHIMA Technologies

Türkiye . 323 parts In-Stock

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323

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TANS Electronics

Latvia . 212 parts In-Stock

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Corohmni

South Africa . 70 parts In-Stock

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Overview

Unleash the power of innovation with the LC895127 by Onsemi! As a leader in consumer ICs, Onsemi guarantees top-notch quality and reliability. This versatile square-shaped IC is perfect for a wide range of applications, offering a seamless integration into your projects. With a package style of flatpack and a terminal pitch of 0.5mm, this IC provides a powerful performance while ensuring efficiency and durability. Trust Onsemi to deliver cutting-edge technology that exceeds expectations, making your projects stand out from the rest. Elevate your designs with the LC895127 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product more affordable for consumers.

Surface Mount: YES

Surface mount components are more compact and can be assembled quickly, improving overall efficiency.

Package Shape: SQUARE

Square packages are easier to handle and store compared to irregular shapes, making this product more user-friendly.

Power Supplies (V): 5

Operating at 5 volts is common in consumer electronics, ensuring compatibility with a wide range of devices.

No. of Terminals: 144

Having a high number of terminals allows for more connectivity options and functionality in the product.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand extended use without overheating.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature ensures the product can function in a wide range of environments and conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Terminal Pitch: 0.5 mm

Having a small terminal pitch allows for tighter spacing of components, enabling a more compact and efficient design.

Technical Specifications

Other Function Consumer ICs LC895127 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G144

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC895127 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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