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LC89561-3151

Onsemi

LC89561-3151 by Onsemi

LC89561-3151 by Onsemi is a consumer IC with 100 terminals in a rectangular flatpack package. Operating temperature ranges from -30 °C to 70°C, powered by 5V supplies. This CMOS technology device is surface mountable and suitable for various consumer circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,760 parts In-Stock

1+ parts

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100+ parts

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1,760

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Digiode

USA . 798 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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798

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 6,041 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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6,041

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Problanco Electronics

Mexico . 3,907 parts In-Stock

1+ parts

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1k+ parts

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3,907

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TANS Electronics

Latvia . 3,788 parts In-Stock

1+ parts

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3,788

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Corphita

USA . 1,514 parts In-Stock

1+ parts

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100+ parts

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1,514

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SupplyDigital Components

Austria . 414 parts In-Stock

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414

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Corohmni

South Africa . 159 parts In-Stock

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159

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UHIMA Technologies

Türkiye . 148 parts In-Stock

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148

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Overview

Discover the LC89561-3151 by Onsemi, a high-quality consumer IC offering unparalleled performance and reliability. With Onsemi's reputation for excellence in the industry, this product is perfect for a variety of applications. From smart home devices to automotive electronics, this IC delivers value, benefits, and advantages that will exceed your expectations. Upgrade your products with the LC89561-3151 and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good protection for the IC, ensuring durability and long-term reliability.

Surface Mount: YES

Surface mount packaging allows for easy and efficient PCB assembly, making it ideal for high-volume production.

Package Shape: RECTANGULAR

The rectangular shape makes handling and mounting the IC straightforward, simplifying the integration process.

Power Supplies (V): 5

Operating at 5 volts allows for compatibility with a wide range of systems and makes it versatile in various consumer applications.

No. of Terminals: 100

Having a large number of terminals enables more complex functions and connections, making the IC suitable for advanced consumer electronics.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the IC can withstand normal environmental conditions, ensuring stable performance.

Minimum Operating Temperature: -30 °C

The ability to operate at temperatures as low as -30 °C allows the IC to function reliably in colder environments.

Technology: CMOS

CMOS technology offers low power consumption, making the IC energy-efficient and suitable for portable consumer devices.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and ease of soldering during assembly, improving overall reliability.

Terminal Pitch: 0.635 mm

The tight terminal pitch allows for high-density packaging and miniaturization, making the IC suitable for compact consumer electronics.

Technical Specifications

Other Function Consumer ICs LC89561-3151 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PQFP-G100

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Trade Compliance

LC89561-3151 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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