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LC890561W

Onsemi

LC890561W by Onsemi

The Onsemi LC890561W is a 48-terminal consumer circuit IC with a power supply of 3.3V, operating b/w -30 °C to 70°C. It features CMOS technology, GULL WING terminals with 0.5mm pitch, and comes in a square PLASTIC/EPOXY package suitable for surface mount applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,180 parts In-Stock

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Vyrian

USA . 257 parts In-Stock

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257

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Kulean Microsystems

USA . 8,086 parts In-Stock

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SupplyDigital Components

Austria . 6,225 parts In-Stock

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Problanco Electronics

Mexico . 5,323 parts In-Stock

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TANS Electronics

Latvia . 4,130 parts In-Stock

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Corphita

USA . 2,183 parts In-Stock

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UHIMA Technologies

Türkiye . 165 parts In-Stock

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Corohmni

South Africa . 122 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the LC890561W by Onsemi. As a leading manufacturer in the industry, Onsemi delivers outstanding performance and innovation in their products. The LC890561W falls under the category of Other Function Consumer ICs, making it versatile for a wide range of applications. With a package body material of PLASTIC/EPOXY and surface mount capability, this product offers convenience and ease of use. Trust in Onsemi to provide top-notch solutions for your consumer circuit needs. Elevate your projects with the value, benefits, and advantages that the LC890561W brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures good durability and protection for the IC inside.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly on circuit boards.

Package Shape: SQUARE

The square shape provides a compact design, saving space on the circuit board.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer applications, making it suitable for a wide range of electronic devices.

Power Supplies (V): 3.3

Operates at a standard voltage of 3.3V, compatible with many electronic systems.

No. of Terminals: 48

With a high number of terminals, this IC can support complex circuit connections and functions.

Package Style (Meter): FLATPACK

The flatpack design allows for a low profile and efficient use of space in electronic devices.

Maximum Operating Temperature: 70 °C

Capable of operating at a relatively high temperature of 70 °C, suitable for various environments.

Minimum Operating Temperature: -30 °C

With a minimum operating temperature of -30 °C, the IC can also withstand cold conditions.

Terminal Position: QUAD

The quad terminal position provides stable connections for the IC within the circuit.

Technology: CMOS

Uses CMOS technology for low power consumption and high performance.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and connection to the circuit board.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5mm, precise connections can be made for optimal performance.

Technical Specifications

Other Function Consumer ICs LC890561W attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC890561W General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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