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LC89091JA-H

Onsemi

LC89091JA-H by Onsemi

LC89091JA-H by Onsemi is a 16-terminal consumer IC with 3.3V power supply, operating b/w -30 to 70 °C. It features CMOS technology, GULL WING terminals, and a small outline package shape. Ideal for various consumer circuit applications requiring low profile components.

Median Price

$1.120

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,217 parts In-Stock

1+ parts

-

100+ parts

$1.120

1k+ parts

$0.930

10k+ parts

$0.829

9,217

-

$1.120

$0.930

$0.829

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 559 parts In-Stock

1+ parts

$0.873

100+ parts

-

1k+ parts

-

10k+ parts

-

559

$0.873

-

-

-

Chip Stock

USA . 136,160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

136,160

-

-

-

-

Vyrian

USA . 2,514 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,514

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 634 parts In-Stock

1+ parts

$0.827

100+ parts

-

1k+ parts

-

10k+ parts

-

634

$0.827

-

-

-

Corohmni

South Africa . 219 parts In-Stock

1+ parts

$0.919

100+ parts

-

1k+ parts

-

10k+ parts

-

219

$0.919

-

-

-

AZTECH Wire

Italy . 568 parts In-Stock

1+ parts

$13.970

100+ parts

-

1k+ parts

-

10k+ parts

-

568

$13.970

-

-

-

Perfect Parts

USA . 145,263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

145,263

-

-

-

-

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

SupplyDigital Components

Austria . 5,021 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,021

-

-

-

-

Kulean Microsystems

USA . 4,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,675

-

-

-

-

TANS Electronics

Latvia . 3,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,975

-

-

-

-

Problanco Electronics

Mexico . 2,355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,355

-

-

-

-

UHIMA Technologies

Türkiye . 690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

690

-

-

-

-

Microchip USA

USA . 316 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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316

-

-

-

-

Overview

Experience the ultimate in quality and performance with the LC89091JA-H by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch consumer ICs like no other. This versatile product is perfect for a wide range of applications and offers unmatched value to our customers. With its small outline, low profile design and advanced technology, this IC provides reliability and efficiency like never before. Upgrade your electronics with the LC89091JA-H and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for consumer applications.

Surface Mount: YES

Surface mount capability allows for easy integration into a variety of electronic devices and circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to fit into compact spaces and design layouts.

Power Supplies (V): 3.3

Operating at 3.3V makes it compatible with a wide range of electronic systems and power sources.

Minimum Operating Temperature: -30 °C

With a low operating temperature of -30 °C, this product can withstand harsh environmental conditions.

Technology: CMOS

CMOS technology ensures low power consumption, making the product energy efficient and cost-effective.

Technical Specifications

Other Function Consumer ICs LC89091JA-H attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e6

Length:

5.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

LC89091JA-H General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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