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LC895198

Onsemi

LC895198 by Onsemi

The Onsemi LC895198 is a consumer IC with 120 terminals, operating at temperatures from 0 to 70 °C. It features power supplies of 3.3V and 5V, suitable for various consumer circuit applications. This CMOS technology device comes in a square-shaped plastic/epoxy package with gull wing terminals for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,411 parts In-Stock

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2,411

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Vyrian

USA . 231 parts In-Stock

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231

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Kulean Microsystems

USA . 7,307 parts In-Stock

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7,307

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Problanco Electronics

Mexico . 6,946 parts In-Stock

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SupplyDigital Components

Austria . 6,885 parts In-Stock

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6,885

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TANS Electronics

Latvia . 3,049 parts In-Stock

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3,049

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UHIMA Technologies

Türkiye . 724 parts In-Stock

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724

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Corphita

USA . 253 parts In-Stock

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253

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Corohmni

South Africa . 133 parts In-Stock

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Overview

Elevate your consumer electronics with the LC895198 by Onsemi. This cutting-edge IC offers unparalleled quality and reliability, thanks to Onsemi's renowned manufacturing expertise. Designed for a wide range of applications in the consumer electronics industry, this product delivers superior performance and efficiency. Experience the value and benefits of seamless integration, enhanced functionality, and optimized power supplies. Trust Onsemi to provide innovative solutions that elevate your products to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components of the IC, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Package Shape: SQUARE

Square package shape provides a compact design, saving space on the PCB and making it ideal for applications with limited space constraints.

Power Supplies (V): 3.3,5

Support for multiple power supply voltages (3.3V and 5V) allows for flexibility in the use of the IC in different electronic systems.

No. of Terminals: 120

With a high number of terminals, this IC can accommodate a wide range of input and output connections, enabling complex circuit designs.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures reliable performance even in elevated temperature conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C indicates that this IC can function effectively in cold environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, making this IC energy-efficient and reliable.

Technical Specifications

Other Function Consumer ICs LC895198 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G120

No. of Terminals:

120

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Trade Compliance

LC895198 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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