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LC75412WS

Onsemi

LC75412WS by Onsemi

LC75412WS by Onsemi is a CMOS Audio Control IC with 64 terminals in a square flatpack package. It operates b/w -40 °C to 85°C, ideal for industrial applications. With a power supply of 9V and max supply current of 60mA, it's suitable for audio system control in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,433 parts In-Stock

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Digiode

USA . 247 parts In-Stock

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247

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Problanco Electronics

Mexico . 8,178 parts In-Stock

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8,178

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Kulean Microsystems

USA . 7,752 parts In-Stock

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SupplyDigital Components

Austria . 5,522 parts In-Stock

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TANS Electronics

Latvia . 1,176 parts In-Stock

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Corphita

USA . 381 parts In-Stock

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Corohmni

South Africa . 309 parts In-Stock

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UHIMA Technologies

Türkiye . 177 parts In-Stock

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Overview

Enhance your audio control experience with the LC75412WS by Onsemi. Manufactured with precision and expertise, this product is designed to deliver top-notch quality and performance. Ideal for a variety of applications in the audio industry, this IC offers unparalleled value and benefits to customers. From its durable plastic/epoxy body to its innovative CMOS technology, the LC75412WS guarantees a seamless integration and operation. Trust Onsemi to provide you with a reliable solution that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protects the internal components of the IC, making it suitable for industrial applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on printed circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape is compact and offers better utilization of space on the PCB, making it ideal for designs with limited space constraints.

Power Supplies (V): 9

Operating at 9V gives the IC sufficient power to perform its audio control functions reliably and efficiently.

No. of Terminals: 64

With 64 terminals, the IC can support a wide range of input and output connections, offering versatility in audio control applications.

Package Style (Meter): FLATPACK

Flatpack package style provides a low profile, making it suitable for space-constrained applications while maintaining good thermal dissipation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures the IC can operate reliably in industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the IC to function effectively in cold environments without any performance degradation.

Terminal Position: QUAD

Quad terminal position offers easy connectivity and ensures stable connections during operation, enhancing the reliability of the product.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures the IC can withstand harsh operating conditions commonly found in industrial settings.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the IC suitable for audio control applications requiring efficient power management.

Terminal Form: GULL WING

Gull wing terminal form offers secure soldering connections and ease of assembly, enhancing the reliability and durability of the product.

Maximum Supply Current: 60 mA

With a maximum supply current of 60mA, the IC operates efficiently without drawing excessive power, making it suitable for power-sensitive applications.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting, enabling compact design layouts and reducing PCB footprint.

Technical Specifications

Audio Control ICs LC75412WS attributes and parameters. Explore more Audio Control ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Audio Control ICs

Maximum Supply Current:

60 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LC75412WS General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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