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LM4841LQ

Texas Instruments

LM4841LQ by Texas Instruments

LM4841LQ by Texas Instruments is a 2-channel volume control circuit with 65 dB channel separation. Operating at temperatures from -40 to 85°C, it requires power supplies of 3-5V and has a max supply current of 30mA. Ideal for audio applications requiring precise volume control in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,518 parts In-Stock

1+ parts

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3,518

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Vyrian

USA . 3,203 parts In-Stock

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3,203

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Anansix

USA . 453 parts In-Stock

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453

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,463 parts In-Stock

1+ parts

$0.398

100+ parts

$36.945

1k+ parts

$0.358

10k+ parts

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1,463

$0.398

$36.945

$0.358

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DigiPath Technology Company

USA . 2,029 parts In-Stock

1+ parts

$0.438

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2,029

$0.438

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ChromeModa Solutions

Germany . 3,366 parts In-Stock

1+ parts

$0.447

100+ parts

$0.367

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3,366

$0.447

$0.367

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IDEA Electronic Components Group

UK . 1,773 parts In-Stock

1+ parts

$0.447

100+ parts

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1k+ parts

$0.402

10k+ parts

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1,773

$0.447

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$0.402

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AZTECH Wire

Italy . 481 parts In-Stock

1+ parts

$9.135

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481

$9.135

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One Stop Electronics

USA . 757 parts In-Stock

1+ parts

$11.800

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757

$11.800

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Corphita

USA . 4,586 parts In-Stock

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4,586

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Kepictronics

USA . 800 parts In-Stock

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800

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Overview

Elevate your audio experience with the LM4841LQ by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers cutting-edge technology in the Audio Control ICs category. This compact chip carrier boasts a volume control circuit with impressive channel separation, making it perfect for a wide range of applications. With its slim profile and easy surface mount installation, the LM4841LQ offers customers unparalleled value and convenience. Upgrade your audio systems today with Texas Instruments' top-of-the-line product.

Feature Benefit Bullets

Surface Mount: YES

Makes installation easy and convenient for circuit board assembly.

General IC Type: VOLUME CONTROL CIRCUIT

Specifically designed for volume control, ensuring precise and accurate control over audio output.

Channel Separation: 65 dB

Provides excellent separation between audio channels, resulting in clear and distinct sound quality.

Power Supplies (V): 3/5

Compatible with a range of power supplies, offering flexibility in system design.

No. of Terminals: 28

Sufficient terminals for connecting various components, allowing for versatile usage.

Maximum Operating Temperature: 85 °C

Can operate effectively even in high temperature environments, ensuring reliability.

Minimum Operating Temperature: -40 °C

Able to function in low temperature conditions, making it suitable for diverse applications.

Terminal Finish: Tin/Lead (Sn85Pb15)

Provides a durable and reliable finish for the terminals, ensuring long-term performance.

No. of Channels: 2

Supports stereo audio output, enabling a more immersive listening experience.

Technical Specifications

Audio Control ICs LM4841LQ attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

65 dB

General IC Type:

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Trade Compliance

LM4841LQ General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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