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LM4811LDX

Texas Instruments

LM4811LDX by Texas Instruments

LM4811LDX by Texas Instruments is a volume control circuit with 100 dB channel separation. It operates on power supplies of 2.6/5V and has a max supply current of 3mA. This audio control IC in a small outline package is ideal for industrial applications requiring precise volume adjustments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,615 parts In-Stock

1+ parts

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6,615

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Digiode

USA . 1,142 parts In-Stock

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1,142

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Anansix

USA . 918 parts In-Stock

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918

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,039 parts In-Stock

1+ parts

$1.601

100+ parts

-

1k+ parts

$2.231

10k+ parts

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2,039

$1.601

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$2.231

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ChromeModa Solutions

Germany . 3,574 parts In-Stock

1+ parts

$1.799

100+ parts

$1.475

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-

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3,574

$1.799

$1.475

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IDEA Electronic Components Group

UK . 1,093 parts In-Stock

1+ parts

$1.799

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$1.619

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1,093

$1.799

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$1.619

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One Stop Electronics

USA . 747 parts In-Stock

1+ parts

$12.800

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747

$12.800

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AZTECH Wire

Italy . 891 parts In-Stock

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$18.264

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891

$18.264

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A-Z Elektronik GmbH

Germany . 12,968 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,995 parts In-Stock

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1,995

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Corphita

USA . 1,925 parts In-Stock

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DigiPath Technology Company

USA . 1,910 parts In-Stock

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$1.622

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1,910

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$1.622

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Kepictronics

USA . 1,027 parts In-Stock

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1,027

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Lixinc

USA . 778 parts In-Stock

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778

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Overview

Elevate your audio experience with the LM4811LDX by Texas Instruments. Crafted with precision and expertise, this Audio Control IC delivers impeccable sound quality and unparalleled channel separation of 100 dB. Ideal for a wide range of applications, this volume control circuit is a game-changer in the industry. Whether you're a tech enthusiast or an audio professional, the LM4811LDX offers exceptional value, benefits, and advantages that will elevate your audio projects to new heights. Trust Texas Instruments to deliver innovation that exceeds expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for mass production.

Channel Separation: 100 dB

High channel separation ensures clear and distinct audio signals for each channel, resulting in high-quality sound output.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and perform reliably under varying temperatures.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows this product to be used in both hot and cold environments without any performance issues.

Maximum Seated Height: 0.8 mm

The low seated height makes this product suitable for compact and slim electronic devices where space is a constraint.

Technical Specifications

Audio Control ICs LM4811LDX attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

100 dB

General IC Type:

JESD-30 Code:

S-XDSO-N10

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC10,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.6/5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

3 mm

Trade Compliance

LM4811LDX General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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