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LM4811YDX/NOPB

Texas Instruments

LM4811YDX/NOPB by Texas Instruments

LM4811YDX/NOPB by Texas Instruments is a dual-function audio control IC with 10 terminals. It operates b/w -40 to 85°C, suitable for industrial applications. With a max supply current of 3mA and peak reflow temperature of 260°C, it's ideal for volume control circuits in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,294 parts In-Stock

1+ parts

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6,294

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Digiode

USA . 2,902 parts In-Stock

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2,902

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Distributors (Availability)

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Parana Technologies

USA . 2,091 parts In-Stock

1+ parts

$2.504

100+ parts

-

1k+ parts

$2.994

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2,091

$2.504

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$2.994

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DigiPath Technology Company

USA . 1,223 parts In-Stock

1+ parts

$2.758

100+ parts

$2.537

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-

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1,223

$2.758

$2.537

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ChromeModa Solutions

Germany . 3,516 parts In-Stock

1+ parts

$2.814

100+ parts

$2.307

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3,516

$2.814

$2.307

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IDEA Electronic Components Group

UK . 1,425 parts In-Stock

1+ parts

$2.814

100+ parts

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$2.533

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1,425

$2.814

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$2.533

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AZTECH Wire

Italy . 251 parts In-Stock

1+ parts

$12.420

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251

$12.420

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One Stop Electronics

USA . 656 parts In-Stock

1+ parts

$18.800

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656

$18.800

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Corphita

USA . 4,968 parts In-Stock

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Microchip USA

USA . 192 parts In-Stock

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192

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Overview

Enhance your audio experience with the LM4811YDX/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Audio Control ICs that are perfect for a variety of applications. With its compact size and dual function design, this volume control circuit offers exceptional value and benefits to customers. Whether you're looking to improve the sound quality of your devices or enhance your overall audio performance, the LM4811YDX/NOPB is the perfect solution for all your audio control needs. Elevate your listening experience with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding too much weight.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly, saving time and reducing production costs.

No. of Functions: 2

Having multiple functions in one IC reduces the need for additional components, simplifying the circuit design and improving efficiency.

General IC Type: VOLUME CONTROL CIRCUIT

A volume control circuit is essential for audio applications, providing precise control over sound levels and improving overall user experience.

Power Supplies (V): 2.6/5

Compatible with commonly used power supply voltages, making it versatile and suitable for a wide range of applications.

No. of Terminals: 10

Having a sufficient number of terminals allows for easy connections and integration with other components in the circuit.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes the IC suitable for use in diverse environments, ensuring reliability and consistent performance.

Maximum Supply Current: 3 mA

Low supply current consumption helps in reducing power consumption and improving overall energy efficiency.

Technical Specifications

Audio Control ICs LM4811YDX/NOPB attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-N10

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC10,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.6/5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

3 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LM4811YDX/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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