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LM1036M/NOPB

Texas Instruments

LM1036M/NOPB by Texas Instruments

LM1036M/NOPB by Texas Instruments is a Tone Control Circuit IC with 2 functions, offering 75 dB channel separation and 0.06% harmonic distortion. Ideal for audio applications, it operates on a power supply of 12V with a min voltage of 9V, featuring dual terminals in a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,706 parts In-Stock

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8,706

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Digiode

USA . 2,081 parts In-Stock

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2,081

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Anansix

USA . 467 parts In-Stock

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467

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Distributors (Availability)

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Parana Technologies

USA . 1,031 parts In-Stock

1+ parts

$1.930

100+ parts

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$2.466

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1,031

$1.930

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$2.466

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ChromeModa Solutions

Germany . 4,441 parts In-Stock

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$2.169

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$1.779

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4,441

$2.169

$1.779

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IDEA Electronic Components Group

UK . 1,454 parts In-Stock

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$2.169

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$1.952

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1,454

$2.169

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$1.952

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One Stop Electronics

USA . 988 parts In-Stock

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$2.800

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988

$2.800

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AZTECH Wire

Italy . 840 parts In-Stock

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$12.846

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840

$12.846

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QUARKTWIN TECHNOLOGY LTD

USA . 15,845 parts In-Stock

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Perfect Parts

USA . 772 parts In-Stock

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Corphita

USA . 523 parts In-Stock

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523

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DigiPath Technology Company

USA . 224 parts In-Stock

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$1.956

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224

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$1.956

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Microchip USA

USA . 206 parts In-Stock

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206

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Overview

Experience exceptional audio control with the LM1036M/NOPB by Texas Instruments. Crafted with precision and expertise, this audio control IC delivers top-notch quality and performance. Perfect for a wide range of applications, this tone control circuit offers unparalleled benefits such as superior channel separation, minimal harmonic distortion, and efficient power supplies. Elevate your audio experience with the LM1036M/NOPB and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Surface Mount: YES

Surface mount technology allows for easy assembly and space-saving design, making it suitable for compact applications.

No. of Functions: 2

Having multiple functions in one IC simplifies the circuit design and saves space on the PCB.

Channel Separation: 75 dB

High channel separation ensures clear and distinct audio output from each channel, enhancing the overall listening experience.

Harmonic Distortion: 0.06 %

Low harmonic distortion results in cleaner and more accurate audio signals, producing high-quality sound.

Power Supplies (V): 12

Operating at a common voltage of 12V makes it compatible with a wide range of audio equipment and power sources.

Package Style: SMALL OUTLINE

The small outline package saves space and allows for compact design, ideal for applications with limited board space.

Temperature Grade: COMMERCIAL

Designed for commercial use, this IC offers reliability and performance in standard operating conditions.

Technology: BIPOLAR

Bipolar technology provides stable performance and helps reduce noise interference, ensuring high-fidelity audio output.

Technical Specifications

Audio Control ICs LM1036M/NOPB attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

75 dB

General IC Type:

Harmonic Distortion:

.06 %

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Bands:

2

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

2.642 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

45 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

9 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

LM1036M/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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