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LM1036NX

Texas Instruments

LM1036NX by Texas Instruments

LM1036NX by Texas Instruments is a dual-channel audio control IC with 75 dB channel separation and 0.06% harmonic distortion. Ideal for tone control circuits, it operates b/w 0-70°C, requires 9-16V supply voltage, and comes in a small outline package suitable for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,999 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,999

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Vyrian

USA . 3,837 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,837

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Anansix

USA . 782 parts In-Stock

1+ parts

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782

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,412 parts In-Stock

1+ parts

$3.017

100+ parts

-

1k+ parts

$3.525

10k+ parts

-

1,412

$3.017

-

$3.525

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ChromeModa Solutions

Germany . 6,760 parts In-Stock

1+ parts

$3.390

100+ parts

$2.780

1k+ parts

-

10k+ parts

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6,760

$3.390

$2.780

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IDEA Electronic Components Group

UK . 2,222 parts In-Stock

1+ parts

$3.390

100+ parts

-

1k+ parts

$3.051

10k+ parts

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2,222

$3.390

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$3.051

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One Stop Electronics

USA . 744 parts In-Stock

1+ parts

$14.800

100+ parts

-

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744

$14.800

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AZTECH Wire

Italy . 671 parts In-Stock

1+ parts

$15.787

100+ parts

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671

$15.787

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Corphita

USA . 2,376 parts In-Stock

1+ parts

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2,376

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DigiPath Technology Company

USA . 389 parts In-Stock

1+ parts

-

100+ parts

$3.056

1k+ parts

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389

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$3.056

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Overview

Enhance your audio experience with the Texas Instruments LM1036NX Audio Control IC. Crafted with precision and quality by a trusted manufacturer, this versatile tone control circuit offers customers the ultimate in audio customization. Whether you're looking to fine-tune your sound system at home or enhance the audio quality in your car, the LM1036NX delivers exceptional performance with minimal distortion. Elevate your listening experience and unlock the full potential of your audio devices with this reliable and innovative product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the audio control IC, making it suitable for long-term use in varying environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

General IC Type: TONE CONTROL CIRCUIT

The tone control circuit type ensures that the audio output can be adjusted to suit individual preferences, enhancing the overall listening experience.

Channel Separation: 75 dB

High channel separation of 75 dB helps to reduce crosstalk and interference between channels, ensuring clear and distinct audio output.

Harmonic Distortion: 0.06 %

Low harmonic distortion of 0.06% ensures that the audio signal remains clean and faithful to the original source, delivering high-quality sound.

No. of Terminals: 20

Having 20 terminals provides flexibility and options for connecting the audio control IC to other components in the system, allowing for versatile integration.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the audio control IC can withstand high temperatures without compromising performance, ensuring reliability in various operating conditions.

No. of Bands: 2

Having 2 bands allows for adjustment of multiple frequency ranges, enabling precise control over the audio output for tailored sound enhancement.

Minimum Supply Voltage (Vsup): 9 V

The minimum supply voltage requirement of 9 V ensures compatibility with standard power sources, making it easy to integrate the audio control IC into existing systems.

No. of Channels: 2

Dual channels provide stereo output capability, delivering a balanced and immersive audio experience for the listener.

Technical Specifications

Audio Control ICs LM1036NX attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

75 dB

General IC Type:

Harmonic Distortion:

.06 %

JESD-30 Code:

R-PDSO-G20

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

9 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

LM1036NX General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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