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LM1036N/NOPB

Texas Instruments

LM1036N/NOPB by Texas Instruments

LM1036N/NOPB by Texas Instruments is a tone control circuit IC with 2 functions, offering 75 dB channel separation and 0.06% harmonic distortion. Ideal for audio applications, it operates b/w 0-70°C with power supplies of 9-16V, making it suitable for various commercial audio control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 6,020 parts In-Stock

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Digiode

USA . 3,470 parts In-Stock

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3,470

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Anansix

USA . 1,739 parts In-Stock

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1,739

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Nova Conductors

Japan . 450 parts In-Stock

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450

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ACDS - Activité Composants Distribution Service

France . 18 parts In-Stock

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Holdelec - ElecDif-Pro

France . 18 parts In-Stock

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Parana Technologies

USA . 2,189 parts In-Stock

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$1.474

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$2.154

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$1.474

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DigiPath Technology Company

USA . 1,792 parts In-Stock

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$1.623

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$1.493

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$1.623

$1.493

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ChromeModa Solutions

Germany . 6,343 parts In-Stock

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$1.656

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$1.358

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$1.656

$1.358

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IDEA Electronic Components Group

UK . 1,700 parts In-Stock

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$1.656

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$1.490

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$1.656

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$1.490

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Ampacity Inc.

Singapore . 345 parts In-Stock

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$2.800

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One Stop Electronics

USA . 607 parts In-Stock

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$3.800

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607

$3.800

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AZTECH Wire

Italy . 196 parts In-Stock

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$14.261

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Corphita

USA . 3,841 parts In-Stock

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Continental Prestige Electronics

USA . 3,750 parts In-Stock

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Argo Parts USA

USA . 2,371 parts In-Stock

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Perfect Parts

USA . 503 parts In-Stock

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503

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Microchip USA

USA . 458 parts In-Stock

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458

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Bastille Electronics

Australia . 85 parts In-Stock

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Overview

Enhance the audio quality of your projects with the LM1036N/NOPB by Texas Instruments. This high-quality Audio Control IC offers precise tone control and exceptional channel separation, ensuring a superior listening experience. With its reliable manufacturer reputation and versatile applications in various audio devices, this product delivers value, benefits, and advantages that will exceed your expectations. Upgrade your sound systems with the LM1036N/NOPB and enjoy unparalleled audio performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the internal circuitry, ensuring long-term reliability.

No. of Functions: 2

Having 2 functions allows for more versatile audio control capabilities, giving users greater control over their sound.

Channel Separation: 75 dB

High channel separation helps prevent interference between channels, resulting in clearer audio output.

Harmonic Distortion: 0.06%

Low harmonic distortion means the audio signal remains faithful to the original source, producing high-quality sound.

Power Supplies (V): 15

Operating at 15V allows for sufficient power to drive the circuitry effectively, ensuring optimal performance.

No. of Terminals: 20

Having 20 terminals provides flexibility in connecting to various audio components, making installation easier.

Minimum Operating Temperature: 0 °C

The ability to operate at 0°C allows for reliable performance in a wide range of environments.

Maximum Operating Temperature: 70 °C

Operating up to 70°C ensures the product can handle high temperatures without overheating or malfunctioning.

Technology: BIPOLAR

Bipolar technology offers high performance and efficiency in audio signal processing, enhancing overall audio quality.

Technical Specifications

Audio Control ICs LM1036N/NOPB attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

75 dB

General IC Type:

Harmonic Distortion:

.06 %

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

26.075 mm

Moisture Sensitivity Level (MSL):

1

No. of Bands:

2

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

9 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

LM1036N/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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