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TDA7417TR

STMicroelectronics

TDA7417TR by STMicroelectronics

TDA7417TR from STMicroelectronics is a versatile audio control IC designed for equalization applications. It features 90 dB channel separation, 0.01% harmonic distortion, and operates within an industrial temp range of -40 °C to 85°C. Ideal for high-performance audio systems, it comes in a low-profile flatpack package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,497 parts In-Stock

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7,497

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Anansix

USA . 2,148 parts In-Stock

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2,148

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Cyclops Electronics Ltd

UK . 1,913 parts In-Stock

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1,913

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Digiode

USA . 799 parts In-Stock

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799

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IDEA Electronic Components Group

UK . 2,298 parts In-Stock

1+ parts

$0.123

100+ parts

-

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$0.111

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2,298

$0.123

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$0.111

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MKK Technologies

India . 2,033 parts In-Stock

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$0.232

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2,033

$0.232

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DigiPath Technology Company

USA . 2,033 parts In-Stock

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$0.232

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2,033

$0.232

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Microchip USA

USA . 1,650 parts In-Stock

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$4.258

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1,650

$4.258

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AZTECH Wire

Italy . 645 parts In-Stock

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$17.140

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645

$17.140

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Kepictronics

USA . 7,600 parts In-Stock

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7,600

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 4,524 parts In-Stock

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4,524

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A-Z Elektronik GmbH

Germany . 2,880 parts In-Stock

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2,880

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Parana Technologies

USA . 565 parts In-Stock

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$0.147

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565

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$0.147

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Overview

Elevate your audio experience with the TDA7417TR from STMicroelectronics, a leader in innovative semiconductor solutions. This premium audio control IC ensures crystal-clear sound quality, making it ideal for high-fidelity applications. With exceptional channel separation and minimal distortion, enjoy immersive and precise audio. Designed for durability and performance, the TDA7417TR empowers your projects with reliability that stands the test of time. Transform your sound today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient integration into compact electronic devices, ideal for modern manufacturing.

Package Shape: SQUARE

The square package shape offers efficient space utilization on PCB layouts, making it versatile for both small and large designs.

General IC Type: EQUALIZER CIRCUIT

This IC is specifically designed for audio equalization, ensuring high-quality sound adjustments for various audio applications.

Channel Separation: 90 dB

A high channel separation of 90 dB minimizes crosstalk, which is essential for cleaner audio playback in multi-channel applications.

Harmonic Distortion: 0.01 %

The very low harmonic distortion indicates high fidelity and clarity in audio reproduction, making it a strong candidate for audiophile-grade equipment.

Power Supplies (V): 8.5

An optimal voltage of 8.5V ensures reliable performance and compatibility with a wide range of power supply configurations.

No. of Terminals: 32

With 32 terminals, this IC provides extensive connectivity options, allowing for complex configurations and multiple signal inputs/outputs.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low-profile design reduces overall height, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85 °C ensures reliability and performance in a range of challenging environments.

No. of Bands: 7

Having 7 bands allows for precise tuning across a wide audio spectrum, providing enhanced control over sound quality.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40 °C makes this IC suitable for industrial applications that require performance in extreme conditions.

Terminal Position: QUAD

A quad terminal position enables efficient layout options on circuit boards, facilitating easier soldering and assembly.

Maximum Seated Height: 1.6 mm

With a maximum seated height of 1.6 mm, it enhances compatibility with various mounting scenarios and maintains a low profile.

Width: 7 mm

The width of 7 mm presents a compact footprint, aiding in design flexibility and reducing the space required on the PCB.

Minimum Supply Voltage (Vsup): 8 V

A minimum supply voltage of 8V ensures sufficient operational headroom for stable performance across various applications.

Length: 7 mm

The 7 mm length contributes to its compact design, allowing it to fit into tighter spaces without compromising functionalities.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature applications guarantees reliability and robustness in demanding operational environments.

Technology: BICMOS

Using BICMOS technology combines the advantages of both Bipolar and CMOS, providing high speed and low power consumption.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and enhances lead strength, improving overall product reliability.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for high-density packaging, enabling more functionality in a smaller space.

Maximum Supply Voltage (Vsup): 9 V

A maximum supply voltage of 9V expands the operational range, allowing for greater design flexibility in power management.

Technical Specifications

Audio Control ICs TDA7417TR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

90 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

No. of Bands:

7

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

8.5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TDA7417TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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