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TDA7052B/N1,112

NXP Semiconductors

TDA7052B/N1,112 by NXP Semiconductors

TDA7052B/N1,112 by NXP Semiconductors is an 8-terminal audio control IC with a rectangular package style. It operates b/w -40 to 85°C and supports supply voltages from 4.5V to 18V. Ideal for volume control circuits in industrial applications due to its compact size and through-hole terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 7,746 parts In-Stock

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Anansix

USA . 1,963 parts In-Stock

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Digiode

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Nova Conductors

Japan . 10 parts In-Stock

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$2.444

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$2.224

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$2.004

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AZTECH Wire

Italy . 316 parts In-Stock

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Ampacity Inc.

Singapore . 239 parts In-Stock

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$19.800

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One Stop Electronics

USA . 1,558 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,970 parts In-Stock

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Microchip USA

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UNI Independent Distributors

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Argo Parts USA

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Corphita

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Continental Prestige Electronics

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Aranea Global

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Overview

Upgrade your audio experience with the TDA7052B/N1,112 by NXP Semiconductors. Known for their top-notch quality and reliability, NXP Semiconductors delivers cutting-edge Audio Control ICs like no other. This volume control circuit is perfect for a wide range of applications, from home entertainment systems to automotive sound systems. With a compact design and industrial-grade temperature rating, this product offers unmatched value and performance. Elevate your audio projects with the TDA7052B/N1,112 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and light weight, making the product easy to handle and transport.

General IC Type: VOLUME CONTROL CIRCUIT

The volume control circuit allows for precise adjustment of audio levels, providing a high-quality sound experience.

Minimum Supply Voltage (Vsup): 4.5 V

With a low minimum supply voltage, this product can operate efficiently even with limited power sources.

Maximum Supply Voltage (Vsup): 18 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, making this product versatile.

Temperature Grade: INDUSTRIAL

The industrial temperature grade allows the product to withstand harsh environmental conditions, ensuring reliable performance in various settings.

Technical Specifications

Audio Control ICs TDA7052B/N1,112 attributes and parameters. Explore more Audio Control ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T8

Length:

9.5 mm

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDA7052B/N1,112 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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