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TDA7052ATD-T

NXP Semiconductors

TDA7052ATD-T by NXP Semiconductors

NXP Semiconductors' TDA7052ATD-T is a volume control circuit with 8 terminals, operating b/w -40 to 85°C. It requires a supply voltage of 4.5-18V and draws a max current of 12mA. This audio IC in small outline package is ideal for industrial temperature grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 1,166 parts In-Stock

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Anansix

USA . 329 parts In-Stock

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329

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Digiode

USA . 64 parts In-Stock

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Aztec Data Supply Inc.

USA . 174 parts In-Stock

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$2.780

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Corohmni

South Africa . 27 parts In-Stock

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$3.741

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Ampacity Inc.

Singapore . 933 parts In-Stock

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$3.800

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AZTECH Wire

Italy . 329 parts In-Stock

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$5.701

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One Stop Electronics

USA . 1,323 parts In-Stock

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$6.800

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UNI Independent Distributors

Spain . 5,203 parts In-Stock

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Argo Parts USA

USA . 3,660 parts In-Stock

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Continental Prestige Electronics

USA . 3,418 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Experience crystal-clear sound quality with the TDA7052ATD-T by NXP Semiconductors, a leading manufacturer in the industry. This audio control IC is perfect for a wide range of applications, providing precise volume control and enhancing your listening experience. With a compact design and industrial-grade temperature resistance, this product offers unmatched value and reliability. Upgrade your audio systems today with the TDA7052ATD-T and enjoy superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and size are important factors.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, reducing production time and costs.

General IC Type: VOLUME CONTROL CIRCUIT

The volume control circuit type ensures precise and smooth volume adjustments, providing high-quality audio outputs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions, ensuring reliable performance.

Minimum Supply Voltage (Vsup): 4.5 V

A low minimum supply voltage requirement allows for operation in low-power applications, making it energy-efficient.

Terminal Pitch: 1.27 mm

The small terminal pitch enables high-density PCB designs, saving space and allowing for compact electronic devices.

Technical Specifications

Audio Control ICs TDA7052ATD-T attributes and parameters. Explore more Audio Control ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

6

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

12 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TDA7052ATD-T General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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