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TDA7303

STMicroelectronics

TDA7303 by STMicroelectronics

TDA7303 by STMicroelectronics is a dual-channel audio control IC designed for volume control applications. It features exceptional channel separation of 103 dB, low harmonic distortion at 0.01%, and operates within a supply voltage range of 6-10 V. Ideal for industrial audio systems, it ensures reliable performance in various environments.

Median Price

$1.826

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 505 parts In-Stock

1+ parts

$1.691

100+ parts

$1.431

1k+ parts

$1.146

10k+ parts

-

505

$1.691

$1.431

$1.146

-

Chip1Stop

Japan . 183 parts In-Stock

1+ parts

-

100+ parts

$1.960

1k+ parts

$1.420

10k+ parts

-

183

-

$1.960

$1.420

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,759 parts In-Stock

1+ parts

$1.607

100+ parts

-

1k+ parts

-

10k+ parts

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2,759

$1.607

-

-

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Vyrian

USA . 4,997 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,997

-

-

-

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Anansix

USA . 2,450 parts In-Stock

1+ parts

-

100+ parts

-

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2,450

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-

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ABC Electronics Ltd.

UK . 36 parts In-Stock

1+ parts

-

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-

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36

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,269 parts In-Stock

1+ parts

$1.522

100+ parts

-

1k+ parts

-

10k+ parts

-

3,269

$1.522

-

-

-

IDEA Electronic Components Group

UK . 1,254 parts In-Stock

1+ parts

$1.676

100+ parts

-

1k+ parts

$1.509

10k+ parts

-

1,254

$1.676

-

$1.509

-

MKK Technologies

India . 1,981 parts In-Stock

1+ parts

$3.152

100+ parts

-

1k+ parts

-

10k+ parts

-

1,981

$3.152

-

-

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DigiPath Technology Company

USA . 1,981 parts In-Stock

1+ parts

$3.152

100+ parts

-

1k+ parts

-

10k+ parts

-

1,981

$3.152

-

-

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AZTECH Wire

Italy . 476 parts In-Stock

1+ parts

$18.890

100+ parts

-

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-

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476

$18.890

-

-

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

-

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Microchip USA

USA . 9,803 parts In-Stock

1+ parts

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9,803

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-

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A-Z Elektronik GmbH

Germany . 6,849 parts In-Stock

1+ parts

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100+ parts

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6,849

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RC Electronics

USA . 4,500 parts In-Stock

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4,500

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Perfect Parts

USA . 1,205 parts In-Stock

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1,205

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Parana Technologies

USA . 1,185 parts In-Stock

1+ parts

-

100+ parts

$2.004

1k+ parts

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1,185

-

$2.004

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Formix International (Excess)

India . 245 parts In-Stock

1+ parts

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245

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iodParts Technologies Inc.

India . 140 parts In-Stock

1+ parts

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140

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Assy Fe

Spain . 2 parts In-Stock

1+ parts

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2

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Overview

Elevate your audio experience with the TDA7303 from STMicroelectronics, a leader in innovation and quality. This advanced audio control IC delivers exceptional sound clarity and precision, boasting impressive channel separation and minimal distortion. Ideal for consumer electronics, automotive systems, and home audio setups, the TDA7303 ensures reliability even in extreme temperatures. Choose STMicroelectronics for unmatched performance and elevate your products today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easier integration into modern circuit designs and helps save space on PCBs.

Package Shape: RECTANGULAR

The rectangular shape facilitates better layout options for PCB design, allowing for efficient use of board space.

General IC Type: VOLUME CONTROL CIRCUIT

Designed specifically for volume control, ensuring optimal performance and ease of integration into audio applications.

Channel Separation: 103 dB

High channel separation minimizes crosstalk between channels, providing clearer audio quality and enhancing the listening experience.

Harmonic Distortion: 0.01%

Low harmonic distortion levels ensure high-fidelity audio output, making it an excellent choice for high-quality sound systems.

Power Supplies (V): 9

A nominal operating voltage of 9V provides flexibility and compatibility with various power supply designs.

No. of Terminals: 28

Multiple terminals allow for comprehensive connectivity options, enhancing functionality in complex audio systems.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on PCBs and is suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature rating ensures reliability under demanding conditions, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures extends the product's usability in diverse environments, including outdoor applications.

Terminal Position: DUAL

Dual terminal positioning aids in stable mounting and ensures ease of soldering during manufacture.

Maximum Seated Height: 2.65 mm

A low seated height allows for a more compact design, which is crucial in space-constrained applications.

Width: 7.5 mm

A compact width contributes to the overall miniaturization of electronic devices, making it suitable for portable applications.

Minimum Supply Voltage (Vsup): 6 V

The minimum supply voltage of 6V allows for flexibility in various designs, suitable for battery-powered devices.

Length: 17.9 mm

The manageable length allows for easy integration into various PCB designs without significant layout constraints.

Temperature Grade: INDUSTRIAL

Designed to meet industrial standards, ensuring reliability and performance in tough operating conditions.

No. of Channels: 2

Dual channel capability is perfect for stereo audio applications, enhancing versatility in audio control.

Technology: CMOS

Utilizing CMOS technology results in lower power consumption and improved efficiency, which is vital for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide a strong mechanical connection, improving the reliability of solder joints.

Maximum Supply Current: 11 mA

A low maximum supply current results in longer battery life for portable devices, making it energy-efficient.

Terminal Pitch: 1.27 mm

Standardized terminal pitch allows for compatibility with commonly used PCB layouts, facilitating ease of design and assembly.

Maximum Supply Voltage (Vsup): 10 V

A maximum supply voltage of 10V provides operational flexibility while ensuring compatibility with a wide range of power sources.

Technical Specifications

Audio Control ICs TDA7303 attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

103 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

11 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TDA7303 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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