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E-TDA7313ND

STMicroelectronics

E-TDA7313ND by STMicroelectronics

E-TDA7313ND by STMicroelectronics is a dual-channel tone control circuit with 103 dB channel separation and only 0.09% harmonic distortion. It operates in industrial temperatures from -40 °C to 85°C, making it ideal for audio applications. This compact IC features a small outline package for easy surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,923 parts In-Stock

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1,923

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Digiode

USA . 1,001 parts In-Stock

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1,001

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Bristol Electronics

USA . 510 parts In-Stock

1+ parts

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510

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Anansix

USA . 334 parts In-Stock

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334

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,361 parts In-Stock

1+ parts

$2.398

100+ parts

-

1k+ parts

$2.159

10k+ parts

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2,361

$2.398

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$2.159

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MKK Technologies

India . 981 parts In-Stock

1+ parts

$4.510

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981

$4.510

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DigiPath Technology Company

USA . 981 parts In-Stock

1+ parts

$4.510

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981

$4.510

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Native Components

USA . 277 parts In-Stock

1+ parts

$198.530

100+ parts

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$190.589

277

$198.530

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$190.589

Northwest PG Solutions

USA . 548 parts In-Stock

1+ parts

$218.383

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548

$218.383

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Corphita

USA . 1,160 parts In-Stock

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1,160

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Parana Technologies

USA . 332 parts In-Stock

1+ parts

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100+ parts

$2.868

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332

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$2.868

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Overview

Experience superior audio control with the E-TDA7313ND from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This advanced tone control IC ensures exceptional sound quality, delivering crystal-clear audio performance for a variety of applications—from home entertainment systems to automotive audio setups. With its compact design and robust temperature range, the E-TDA7313ND guarantees reliability and versatility, empowering customers to elevate their audio experiences effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and robustness, making the IC suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy integration into modern PCB designs, enhancing versatility and reducing assembly costs.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on PCBs, optimizing layout options for designers.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, it provides precise sound adjustment features, ideal for audio applications that demand high fidelity.

Channel Separation: 103 dB

High channel separation ensures minimal crosstalk between channels, delivering clearer audio playback and a superior listening experience.

Harmonic Distortion: 0.09%

Low harmonic distortion indicates high audio quality, resulting in cleaner sound reproduction without unwanted artifacts.

No. of Terminals: 28

A higher number of terminals allows for more features and functionalities, providing versatility in audio applications.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the PCB, making it a perfect fit for compact electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC is capable of functioning in demanding thermal environments.

No. of Bands: 2

Offering 2 bands allows for flexible sound tuning options, catering to specific audio preferences and environments.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures expands its usability in a variety of industrial and outdoor applications.

Terminal Position: DUAL

Dual terminal positioning facilitates easier assembly and soldering, improving manufacturing efficiency.

Maximum Seated Height: 2.65 mm

Low seated height is advantageous for designs requiring a compact form factor, allowing for slim device profiles.

Width: 7.5 mm

A compact width aids in fitting the IC into space-constrained designs, enhancing product design flexibility.

Minimum Supply Voltage (Vsup): 6 V

Lower supply voltage requirements improve power efficiency, which is crucial for battery-operated devices.

Length: 17.9 mm

The optimal length supports compact design, making it suitable for a variety of audio systems.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and stability in harsh conditions, making it suitable for professional applications.

No. of Channels: 2

Dual-channel support allows for stereo output, enhancing the listening experience in consumer audio products.

Technology: BICMOS

BICMOS technology combines the advantages of bipolar and CMOS transistors resulting in lower power consumption and high performance.

Terminal Form: GULL WING

Gull wing terminals provide a robust soldering surface, ensuring better reliability and ease of manufacturing.

Terminal Pitch: 1.27 mm

A standard terminal pitch allows for compatibility with various PCB designs and assembly processes.

Maximum Supply Voltage (Vsup): 10 V

A higher maximum supply voltage provides greater flexibility for integration into diverse audio systems.

Technical Specifications

Audio Control ICs E-TDA7313ND attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

103 dB

General IC Type:

Harmonic Distortion:

.09 %

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

E-TDA7313ND General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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