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E-TDA7437NTR

STMicroelectronics

E-TDA7437NTR by STMicroelectronics

E-TDA7437NTR from STMicroelectronics is a versatile audio control IC designed for tone control applications. It features 95 dB channel separation, 0.01% harmonic distortion, and operates within a -40 °C to 85°C range. Ideal for industrial audio systems, it supports dual channels with low-profile packaging.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,230 parts In-Stock

1+ parts

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3,230

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Digiode

USA . 466 parts In-Stock

1+ parts

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466

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Anansix

USA . 348 parts In-Stock

1+ parts

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348

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 456 parts In-Stock

1+ parts

$1.538

100+ parts

-

1k+ parts

$1.384

10k+ parts

-

456

$1.538

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$1.384

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MKK Technologies

India . 2,332 parts In-Stock

1+ parts

$2.893

100+ parts

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2,332

$2.893

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DigiPath Technology Company

USA . 2,332 parts In-Stock

1+ parts

$2.893

100+ parts

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2,332

$2.893

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Corphita

USA . 2,581 parts In-Stock

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2,581

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Northwest PG Solutions

USA . 1,753 parts In-Stock

1+ parts

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$3.244

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1,753

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$3.244

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Native Components

USA . 573 parts In-Stock

1+ parts

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100+ parts

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$3.211

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573

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$3.211

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Parana Technologies

USA . 465 parts In-Stock

1+ parts

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$1.839

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465

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$1.839

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Overview

Elevate your audio experience with the E-TDA7437NTR from STMicroelectronics, renowned for exceptional quality and innovation. This advanced audio control IC delivers pristine sound clarity and superior channel separation, ensuring an immersive listening journey. Ideal for home audio systems, automotive applications, and professional equipment, it seamlessly combines reliability and performance, making it the smart choice for elevating your audio solutions. Unlock the full potential of your projects with unmatched precision and ease!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection against environmental factors, making it well-suited for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs, ensuring a more efficient manufacturing process.

Package Shape: SQUARE

The square shape optimizes the use of board space, allowing for more compact circuit designs.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit IC, it enhances audio quality by providing precise control over sound frequencies, making it ideal for audio applications.

Channel Separation: 95 dB

High channel separation ensures clear separation between audio channels, preventing crosstalk and enriching the listening experience.

Harmonic Distortion: 0.01 %

Extremely low harmonic distortion guarantees high fidelity sound reproduction, ensuring that audio integrity is maintained.

Power Supplies (V): 9

Operates efficiently at a standard voltage of 9V, making it compatible with many audio systems.

No. of Terminals: 44

A larger number of terminals allows for more complex functionality and connectivity options in audio applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE

The low-profile design with heat sink capabilities allows for better thermal management, enhancing reliability in high-performance environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can operate reliably in demanding conditions.

No. of Bands: 3

Three bands of audio control allow for detailed sound customization, providing flexibility for audio tuning.

Minimum Operating Temperature: -40 °C

A wide temperature range ensures reliability in extreme conditions, ideal for industrial applications.

Terminal Position: QUAD

Quad terminal positioning enhances layout flexibility, facilitating easier PCB design.

Maximum Seated Height: 1.6 mm

A low seated height fits into sleek designs without compromising performance, making it suitable for modern electronics.

Width: 10 mm

Compact width contributes to a reduced footprint, allowing for more efficient use of space on PCBs.

Minimum Supply Voltage (Vsup): 6 V

Operates down to 6V, allowing for compatibility with a range of power supplies.

Length: 10 mm

Short length complements its compact design, facilitating integration into space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in challenging environments, making it suitable for various applications.

No. of Channels: 2

Two-channel functionality allows for stereo sound handling, crucial for high-quality audio output.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making it efficient for audio processing.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide stable electrical connections, enhancing overall reliability.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for high-density packaging, enabling use in compact designs.

Maximum Supply Voltage (Vsup): 10.2 V

Compatible with a maximum supply voltage of 10.2V, providing flexibility in power supply options.

Technical Specifications

Audio Control ICs E-TDA7437NTR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

95 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of Bands:

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

E-TDA7437NTR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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