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E-TDA7409DTR

STMicroelectronics

E-TDA7409DTR by STMicroelectronics

E-TDA7409DTR by STMicroelectronics is a compact audio control IC designed for tone control applications. It features 100 dB channel separation, 0.005% harmonic distortion, and operates b/w -40 °C to 85°C. Ideal for industrial audio systems, it ensures high-quality sound performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,055 parts In-Stock

1+ parts

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6,055

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Anansix

USA . 1,830 parts In-Stock

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1,830

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Digiode

USA . 1,480 parts In-Stock

1+ parts

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1,480

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 389 parts In-Stock

1+ parts

$0.676

100+ parts

-

1k+ parts

$0.609

10k+ parts

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389

$0.676

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$0.609

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MKK Technologies

India . 782 parts In-Stock

1+ parts

$1.272

100+ parts

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782

$1.272

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DigiPath Technology Company

USA . 782 parts In-Stock

1+ parts

$1.272

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782

$1.272

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Native Components

USA . 277 parts In-Stock

1+ parts

$7.730

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277

$7.730

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AZTECH Wire

Italy . 1,044 parts In-Stock

1+ parts

$14.840

100+ parts

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1,044

$14.840

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Corphita

USA . 4,836 parts In-Stock

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4,836

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Microchip USA

USA . 3,624 parts In-Stock

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3,624

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Northwest PG Solutions

USA . 1,008 parts In-Stock

1+ parts

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$7.575

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1,008

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$7.575

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Parana Technologies

USA . 174 parts In-Stock

1+ parts

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$0.808

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174

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$0.808

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Overview

Elevate your audio experience with the E-TDA7409DTR from STMicroelectronics, a leader in innovation and quality. Designed for exceptional sound control, this compact audio IC ensures superior channel separation and minimal distortion, making it ideal for diverse applications from home entertainment to automotive sound systems. Trust STMicroelectronics to deliver reliability and performance that enhance your products, providing unmatched value for your customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protects the internal components, ensuring reliability in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient production processes, making it easier to integrate into modern electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape optimizes PCB space, enabling more efficient layout and design flexibility.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, it enhances audio quality by allowing precise adjustments to frequency response, making it ideal for high-fidelity audio applications.

Channel Separation: 100 dB

High channel separation minimizes crosstalk between audio channels, resulting in clearer sound and improved audio experience.

Harmonic Distortion: 0.005 %

Low harmonic distortion ensures that audio signals remain clean and true to the original sound, making it suitable for professional audio systems.

No. of Terminals: 20

A higher number of terminals offers more connectivity options, enabling versatile integration into various audio control systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style is space-efficient, allowing for miniaturization in circuit design without compromising performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can perform reliably in demanding conditions, suitable for industrial applications.

No. of Bands: 2

Having two bands allows for enhanced audio tuning, providing users with more precision in tonal adjustments.

Minimum Operating Temperature: -40 °C

A wide operating temperature range makes this IC reliable in extreme conditions, suitable for a variety of industrial applications.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting and integration options in PCB designs.

Maximum Seated Height: 2.65 mm

The low seated height aids in achieving a compact design, fitting easily into tight spaces in modern electronic devices.

Width: 7.5 mm

A compact width contributes to the overall miniaturization of circuits, helping designers save space.

Minimum Supply Voltage (Vsup): 7.5 V

The minimum supply voltage allows for operation in a variety of power supply configurations, enhancing flexibility in design.

Length: 12.8 mm

This moderate length supports compact PCBs while offering sufficient space for internal circuitry and connections.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements, this IC ensures robust performance in harsh environments.

Technology: BICMOS

BICMOS technology combines the advantages of bipolar and CMOS, providing low power consumption while maintaining high-speed performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve the stability of the component on the PCB.

Terminal Pitch: 1.27 mm

With a standard terminal pitch, this IC can be easily integrated into existing circuit designs, ensuring compatibility with common PCB layouts.

Maximum Supply Voltage (Vsup): 10.5 V

The maximum supply voltage allows for high-performance operation while accommodating a variety of power supply voltages in applications.

Technical Specifications

Audio Control ICs E-TDA7409DTR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.005 %

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Bands:

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

10.5 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

E-TDA7409DTR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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