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LM4839MT

Texas Instruments

LM4839MT by Texas Instruments

LM4839MT by Texas Instruments is a 2-channel audio control IC with tone control circuit. Features include 65 dB channel separation, 5V power supply, and 30 mA max supply current. Ideal for industrial applications requiring small outline package with gull wing terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,772 parts In-Stock

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Digiode

USA . 4,372 parts In-Stock

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Anansix

USA . 1,562 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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Parana Technologies

USA . 1,378 parts In-Stock

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$1.162

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$1.973

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1,378

$1.162

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$1.973

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DigiPath Technology Company

USA . 921 parts In-Stock

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$1.280

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921

$1.280

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IDEA Electronic Components Group

UK . 2,214 parts In-Stock

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$1.306

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$1.175

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$1.306

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$1.175

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ChromeModa Solutions

Germany . 1,435 parts In-Stock

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$1.306

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$1.071

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$1.306

$1.071

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AZTECH Wire

Italy . 361 parts In-Stock

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$15.336

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One Stop Electronics

USA . 1,608 parts In-Stock

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$19.800

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$19.800

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Component Stockers USA

USA . 394 parts In-Stock

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$99.990

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394

$99.990

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Corphita

USA . 4,096 parts In-Stock

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Kepictronics

USA . 688 parts In-Stock

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Perfect Parts

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Overview

Enhance your audio experience with the LM4839MT by Texas Instruments, a top-quality Audio Control IC designed to elevate your sound system to new heights. With a reputation for excellence, Texas Instruments delivers unmatched performance and reliability in all their products. Ideal for applications requiring precise tone control, this compact IC offers superior channel separation and low power consumption, making it perfect for a wide range of audio devices. Discover the value and benefits of the LM4839MT today and take your audio quality to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making this product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy integration and space-saving design, making the product suitable for compact electronic devices.

Channel Separation: 65 dB

High channel separation ensures clear and distinct audio output, making this product ideal for audio applications where noise interference is a concern.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions, increasing its reliability and longevity.

Minimum Operating Temperature: -40 °C

The wide temperature range at which this product operates ensures functionality in both extreme cold and hot environments, making it versatile for various applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options, making this product compatible with a wide range of electronic systems.

Technical Specifications

Audio Control ICs LM4839MT attributes and parameters. Explore more Audio Control ICs devices from Texas Instruments

Specs

Channel Separation:

65 dB

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

3

No. of Bands:

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

LM4839MT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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