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TDA7409D

STMicroelectronics

TDA7409D by STMicroelectronics

TDA7409D by STMicroelectronics is a versatile audio control IC designed for tone control applications. It features 100 dB channel separation, 0.005% harmonic distortion, and operates within a supply voltage range of 7.5V to 10.5V, making it ideal for industrial audio systems. Its compact SO package ensures easy integration in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,221 parts In-Stock

1+ parts

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4,221

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Digiode

USA . 2,761 parts In-Stock

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2,761

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Anansix

USA . 2,664 parts In-Stock

1+ parts

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2,664

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 319 parts In-Stock

1+ parts

$1.338

100+ parts

-

1k+ parts

$1.204

10k+ parts

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319

$1.338

-

$1.204

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MKK Technologies

India . 797 parts In-Stock

1+ parts

$2.515

100+ parts

-

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797

$2.515

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DigiPath Technology Company

USA . 797 parts In-Stock

1+ parts

$2.515

100+ parts

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797

$2.515

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Microchip USA

USA . 333 parts In-Stock

1+ parts

$3.318

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333

$3.318

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AZTECH Wire

Italy . 294 parts In-Stock

1+ parts

$9.180

100+ parts

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294

$9.180

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Corphita

USA . 3,196 parts In-Stock

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3,196

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Parana Technologies

USA . 1,594 parts In-Stock

1+ parts

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$1.599

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1,594

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$1.599

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Overview

Elevate your audio experience with the TDA7409D from STMicroelectronics, a leader in innovative technology. This reliable audio control IC ensures exceptional sound quality and precision with remarkable channel separation and minimal distortion. Perfect for diverse applications, from automotive to home entertainment systems, it delivers versatility and performance. Trust in STMicroelectronics' commitment to excellence for unparalleled audio solutions that enhance every listening experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy indicates durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for more compact designs and easier assembly, which is ideal for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape is efficient for PCB layout and maximizes space utilization in circuit designs.

General IC Type: TONE CONTROL CIRCUIT

As a tone control circuit, this IC enhances sound quality, allowing for tailored audio experiences, making it perfect for audio applications.

Channel Separation: 100 dB

High channel separation reduces crosstalk, ensuring clear and distinct audio outputs, crucial for high-fidelity audio systems.

Harmonic Distortion: 0.005 %

Minimal harmonic distortion guarantees high-quality audio reproduction, making it an excellent choice for professional audio equipment.

Power Supplies (V): 9

A nominal supply voltage of 9V is standard for many audio applications, facilitating easy integration into existing systems.

No. of Terminals: 20

A higher number of terminals allows for more versatile connections, enhancing the IC's ability to interface with various components.

Package Style (Meter): SMALL OUTLINE

The small outline package style supports more compact designs, an advantage for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is robust enough for demanding industrial applications.

No. of Bands: 2

Two bands allow for effective audio frequency adjustment, providing users with flexibility in tuning their sound preferences.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature ensures reliable performance in harsh environments, making it suitable for outdoor and industrial use.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance, enhancing longevity and reliability in electronic connections.

Terminal Position: DUAL

Strategically positioned terminals simplify layout design and offer greater ease of soldering, improving manufacturing efficiency.

Maximum Seated Height: 2.65 mm

A low maximum seated height aids in achieving low-profile designs, making the IC ideal for compact devices.

Width: 7.5 mm

Compact width allows for efficient use of space on PCBs, vital for densely packed modern electronics.

Minimum Supply Voltage (Vsup): 7.5 V

Flexibility with a minimum supply voltage of 7.5 V accommodates a variety of power supply configurations.

Length: 12.8 mm

A reasonable length supports space-efficient board design, enhancing integration into various audio devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures this IC operates reliably under extreme conditions, suitable for rigorous applications.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS processes, offering high performance with low power consumption.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve electrical performance, ideal for automated assembly processes.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is compatible with standard PCB layouts, promoting ease of integration into existing designs.

Maximum Supply Voltage (Vsup): 10.5 V

A maximum supply voltage of 10.5 V provides flexibility for design configurations, accommodating various audio application requirements.

Technical Specifications

Audio Control ICs TDA7409D attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.005 %

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

No. of Bands:

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10.5 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7409D General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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