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STA369BWSTR

STMicroelectronics

STA369BWSTR by STMicroelectronics

STA369BWSTR from STMicroelectronics is a versatile audio control IC designed for volume management in compact devices. It operates at 3.3V and 18V, with a temperature range of -20 °C to 70°C. Its small outline package and surface mount design make it ideal for space-constrained applications.

Median Price

$3.790

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 799 parts In-Stock

1+ parts

$5.700

100+ parts

$3.210

1k+ parts

$2.280

10k+ parts

$2.200

799

$5.700

$3.210

$2.280

$2.200

Future Electronics

Canada . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.880

10k+ parts

-

1,000

-

-

$1.880

-

Avnet

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,407 parts In-Stock

1+ parts

$4.760

100+ parts

-

1k+ parts

-

10k+ parts

-

2,407

$4.760

-

-

-

Vyrian

USA . 7,907 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,907

-

-

-

-

Flip Electronics

USA . 1,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,200

-

-

-

-

IBS Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.145

10k+ parts

$2.119

1,000

-

-

$2.145

$2.119

Anansix

USA . 852 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

852

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,463 parts In-Stock

1+ parts

$0.216

100+ parts

-

1k+ parts

$0.195

10k+ parts

-

1,463

$0.216

-

$0.195

-

MKK Technologies

India . 1,022 parts In-Stock

1+ parts

$0.407

100+ parts

-

1k+ parts

-

10k+ parts

-

1,022

$0.407

-

-

-

DigiPath Technology Company

USA . 1,022 parts In-Stock

1+ parts

$0.407

100+ parts

-

1k+ parts

-

10k+ parts

-

1,022

$0.407

-

-

-

Vigor

Singapore . 1,417 parts In-Stock

1+ parts

$1.400

100+ parts

-

1k+ parts

-

10k+ parts

-

1,417

$1.400

-

-

-

Corphita

USA . 4,096 parts In-Stock

1+ parts

$4.509

100+ parts

-

1k+ parts

-

10k+ parts

-

4,096

$4.509

-

-

-

Microchip USA

USA . 2,791 parts In-Stock

1+ parts

$18.812

100+ parts

-

1k+ parts

-

10k+ parts

-

2,791

$18.812

-

-

-

RC Electronics

USA . 46,430 parts In-Stock

1+ parts

-

100+ parts

$2.420

1k+ parts

$2.200

10k+ parts

$2.120

46,430

-

$2.420

$2.200

$2.120

Kepictronics

USA . 13,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,696 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,696

-

-

-

-

Perfect Parts

USA . 2,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,240

-

-

-

-

Benley Electronics

USA . 2,090 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,090

-

-

-

-

GreenTree Electronics

Israel . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Parana Technologies

USA . 812 parts In-Stock

1+ parts

-

100+ parts

$0.258

1k+ parts

-

10k+ parts

-

812

-

$0.258

-

-

Overview

Elevate your audio experience with the STA369BWSTR from STMicroelectronics, a leader in innovative solutions. This versatile audio control IC ensures seamless volume adjustments with unmatched reliability, making it ideal for various applications from consumer electronics to automotive systems. Designed for durability and precision, it excels in performance even in challenging environments, delivering superior sound quality that enhances your products and captivates your audience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability, making it suitable for various audio applications.

Surface Mount: YES

Being surface mount compatible allows for easy integration into modern circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout efficiency and enhances thermal performance, fitting well into compact designs.

General IC Type: VOLUME CONTROL CIRCUIT

Designed specifically for volume control, this IC provides precise audio signal management, making it ideal for audio devices.

Power Supplies (V): 3.3, 18

Supporting dual power supply voltages of 3.3V and 18V offers flexibility in design for a variety of audio equipment.

No. of Terminals: 36

With 36 terminals, this IC provides extensive connectivity options for complex audio control functions, enhancing versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, allowing manufacturers to design more compact devices.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures stable performance even under demanding conditions, contributing to product longevity.

Minimum Operating Temperature: -20 °C

The ability to function in low temperatures (-20 °C) makes this IC suitable for a wide range of environmental conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin terminal finish provides excellent solderability and is resistant to oxidation, ensuring high reliability in connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible circuit board layout and optimized routing, enhancing the design's overall efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures reliable soldering during assembly, preventing damage to the IC during manufacturing.

Peak Reflow Temperature (°C): 260

Operating at a peak reflow temperature of 260 °C ensures compatibility with soldering processes, enabling efficient production.

Temperature Grade: COMMERCIAL

Rated for commercial temperature grades, this IC is designed for reliable performance in a wide range of everyday applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and improves assembly efficiency, making it a preferred choice for manufacturers.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this IC is optimized for high-density applications, allowing for more compact PCB designs.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates moderate sensitivity, making proper handling and storage essential but manageable for manufacturers.

Technical Specifications

Audio Control ICs STA369BWSTR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,18

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STA369BWSTR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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