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STA306

STMicroelectronics

STA306 by STMicroelectronics

STA306 by STMicroelectronics is a versatile audio control IC designed for tone control applications. It operates within a supply voltage range of 2.3-2.7V and features a low-profile flatpack design with 64 terminals. With a max temp of 70 °C, it ensures reliable performance in various audio systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,523 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,523

-

-

-

-

Digiode

USA . 2,557 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,557

-

-

-

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Anansix

USA . 402 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

402

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,799 parts In-Stock

1+ parts

$2.292

100+ parts

-

1k+ parts

$2.063

10k+ parts

-

1,799

$2.292

-

$2.063

-

MKK Technologies

India . 291 parts In-Stock

1+ parts

$4.309

100+ parts

-

1k+ parts

-

10k+ parts

-

291

$4.309

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-

-

DigiPath Technology Company

USA . 291 parts In-Stock

1+ parts

$4.309

100+ parts

-

1k+ parts

-

10k+ parts

-

291

$4.309

-

-

-

Semicontronic

India . 1,178 parts In-Stock

1+ parts

$16.800

100+ parts

$16.380

1k+ parts

$16.296

10k+ parts

-

1,178

$16.800

$16.380

$16.296

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Corphita

USA . 2,994 parts In-Stock

1+ parts

-

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1k+ parts

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2,994

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Kepictronics

USA . 500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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500

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-

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Parana Technologies

USA . 88 parts In-Stock

1+ parts

-

100+ parts

$2.740

1k+ parts

-

10k+ parts

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88

-

$2.740

-

-

Overview

Elevate your audio experience with the STA306 from STMicroelectronics, a leader in innovation. This advanced audio control IC delivers unparalleled sound quality and versatility for various applications, from home theaters to portable devices. With its sleek design and reliable performance, the STA306 not only enhances your audio output but also ensures energy efficiency. Trust in ST's commitment to excellence and transform how you enjoy sound today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures the product is robust and capable of withstanding various environmental conditions.

Surface Mount: YES

Being surface mount allows for a more compact design and easier integration into modern circuit boards.

Package Shape: SQUARE

A square package shape optimizes space usage in PCB layouts, ensuring efficient design without wasted area.

General IC Type: TONE CONTROL CIRCUIT

This IC is specifically designed for tone control, making it ideal for audio applications requiring fine-tuned sound output.

Power Supplies (V): 2.5, 3.3

Supporting multiple supply voltages makes the IC versatile for different applications, enhancing compatibility with various systems.

No. of Terminals: 64

With 64 terminals, the IC provides a wide array of connectivity options, supporting complex functionality and integration.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile design saves space on PCBs and is suitable for modern, compact electronic devices, making installation straightforward.

Maximum Operating Temperature: 70 °C

High maximum operating temperature indicates reliability and stability in warmer environments, enhancing overall performance.

No. of Bands: 2

Offering 2 bands allows for basic tone adjustment, suitable for standard audio applications while keeping the design simple.

Minimum Operating Temperature: 0 °C

Operates from 0 °C and above, making it functional in a range of mild climate of applications without risk of failure.

Terminal Finish: NICKEL PALLADIUM GOLD

The gold finish on terminals ensures excellent conductivity and prevents oxidation, ensuring a reliable and long-lasting connection.

Terminal Position: QUAD

Quad terminal layout allows for higher packing density and efficient routing on the PCB, facilitating advanced design capabilities.

Maximum Seated Height: 1.6 mm

Its low seated height is advantageous for applications where space is a premium, contributing to slimmer device profiles.

Width: 10 mm

A compact width of 10 mm allows for efficient integration into various circuit designs without taking up too much space.

Minimum Supply Voltage (Vsup): 2.3 V

Ability to operate at a lower supply voltage enhances its compatibility with battery-operated devices, contributing to power efficiency.

Length: 10 mm

A standardized length of 10 mm complements the compact design, facilitating easy placement on printed circuit boards.

Temperature Grade: COMMERCIAL

Being commercially graded ensures reliability in typical operating environments, suitable for consumer electronics.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and assembly processes, improving manufacturing efficiency.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for denser packing of components, enabling the design of smaller, more complex electronic devices.

Maximum Supply Voltage (Vsup): 2.7 V

The ability to operate at higher supply voltages (up to 2.7 V) allows for increased performance and capability in audio applications.

Technical Specifications

Audio Control ICs STA306 attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

No. of Bands:

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

STA306 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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