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TDA7340P

STMicroelectronics

TDA7340P by STMicroelectronics

TDA7340P by STMicroelectronics is a BICMOS audio control IC with 2 channels, offering tone control circuitry. It features 100 dB channel separation and 0.01% harmonic distortion, suitable for industrial temperature grade applications. With a package style of flatpack and surface mount capability, it has 44 terminals in a square shape measuring 10mm x 10mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,595 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,595

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Digiode

USA . 3,607 parts In-Stock

1+ parts

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3,607

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Anansix

USA . 2,758 parts In-Stock

1+ parts

-

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2,758

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,994 parts In-Stock

1+ parts

$2.628

100+ parts

-

1k+ parts

$2.366

10k+ parts

-

1,994

$2.628

-

$2.366

-

MKK Technologies

India . 273 parts In-Stock

1+ parts

$4.943

100+ parts

-

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-

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273

$4.943

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DigiPath Technology Company

USA . 273 parts In-Stock

1+ parts

$4.943

100+ parts

-

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10k+ parts

-

273

$4.943

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-

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Kepictronics

USA . 7,504 parts In-Stock

1+ parts

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7,504

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Corphita

USA . 3,690 parts In-Stock

1+ parts

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3,690

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Parana Technologies

USA . 1,803 parts In-Stock

1+ parts

-

100+ parts

$3.143

1k+ parts

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10k+ parts

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1,803

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$3.143

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A-Z Elektronik GmbH

Germany . 1,665 parts In-Stock

1+ parts

-

100+ parts

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1,665

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Overview

Enhance your audio experience with the TDA7340P from STMicroelectronics, a leading manufacturer known for top-quality audio control ICs. This tone control circuit offers impeccable channel separation of 100 dB and minimal harmonic distortion of just 0.01%. Perfect for applications where precise audio control is essential, this product provides value by delivering exceptional sound quality and performance. Upgrade your audio systems with the TDA7340P and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the IC, ensuring a long lifespan for the product.

Surface Mount: YES

Being surface mount enables easy and efficient assembly of the IC onto circuit boards, saving time and effort during manufacturing processes.

Channel Separation: 100 dB

High channel separation ensures clear and distinct audio output for each channel, resulting in a crisp and immersive listening experience.

Harmonic Distortion: 0.01 %

With low harmonic distortion, the audio signal remains faithful to the original input, delivering high-quality sound reproduction with minimal interference or distortion.

Power Supplies (V): 9

Operating at a voltage of 9V allows for compatibility with a wide range of electronic devices and power sources, making the IC versatile for various applications.

No. of Terminals: 44

Having 44 terminals provides ample connectivity options for interfacing with other components or devices, enhancing the flexibility and functionality of the IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the IC can function reliably in demanding environments or applications without overheating or malfunctioning.

No. of Channels: 2

Featuring two channels allows for stereo audio processing, enabling the IC to handle dual audio signals simultaneously for immersive audio playback or mixing.

Technical Specifications

Audio Control ICs TDA7340P attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e0

Length:

10 mm

No. of Bands:

2

No. of Channels:

2

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.5SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TDA7340P General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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