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TDA7463

STMicroelectronics

TDA7463 by STMicroelectronics

TDA7463 by STMicroelectronics is a dual-channel tone control IC designed for audio applications. It features 80 dB channel separation, operates b/w 1.8V and 3V, and supports temperatures from -10 °C to 85°C. Ideal for enhancing sound quality in consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,608 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

4,608

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-

-

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Digiode

USA . 4,139 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,139

-

-

-

-

Anansix

USA . 1,823 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,823

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,226 parts In-Stock

1+ parts

$1.450

100+ parts

-

1k+ parts

$1.305

10k+ parts

-

2,226

$1.450

-

$1.305

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MKK Technologies

India . 1,985 parts In-Stock

1+ parts

$2.726

100+ parts

-

1k+ parts

-

10k+ parts

-

1,985

$2.726

-

-

-

DigiPath Technology Company

USA . 1,985 parts In-Stock

1+ parts

$2.726

100+ parts

-

1k+ parts

-

10k+ parts

-

1,985

$2.726

-

-

-

Corphita

USA . 3,892 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,892

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-

-

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Parana Technologies

USA . 269 parts In-Stock

1+ parts

-

100+ parts

$1.734

1k+ parts

-

10k+ parts

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269

-

$1.734

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Overview

Elevate your audio experience with the TDA7463 from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile audio control IC delivers superior sound quality and precise tone adjustments, ensuring an immersive listening experience for various applications—from home theater systems to automotive audio setups. With its robust design and reliable performance, the TDA7463 offers exceptional value, empowering customers to achieve professional-grade audio effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides good protection against environmental factors, making the IC reliable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on circuit boards, optimizing layout possibilities.

General IC Type: TONE CONTROL CIRCUIT

A dedicated tone control circuit enhances audio quality, making it suitable for audio applications requiring sound customization.

Channel Separation: 80 dB

High channel separation minimizes audio crosstalk, ensuring clear and distinct sound in multi-channel applications.

Power Supplies (V): 2.4

Operating at a moderate supply voltage ensures compatibility with a wide range of systems while maintaining efficiency.

No. of Terminals: 16

Having 16 terminals allows for a variety of connections, offering flexibility in circuit design and integration.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy assembly and integration into circuit boards, saving development time.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures reliable performance in demanding environments without risking thermal failure.

No. of Bands: 2

Two bands of control allow for refined sound adjustments, appealing to audiophiles who value audio fidelity.

Minimum Operating Temperature: -10 °C

The ability to operate in low temperatures expands application possibilities in varying environments.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and corrosion resistance, enhancing longevity and reliability of connections.

Terminal Position: DUAL

Dual terminal position improves layout options and simplifies routing in compact designs.

Maximum Seated Height: 5.1 mm

Low seated height allows for compact design, enabling space-saving solutions in tight electronic applications.

Width: 7.62 mm

A narrow width makes it ideal for integration into space-constrained designs without sacrificing performance.

Minimum Supply Voltage (Vsup): 1.8 V

Lower supply voltage requirement enhances compatibility with battery-powered devices, maximizing energy efficiency.

No. of Channels: 2

Dual-channel configuration supports stereo applications, making it versatile for consumer audio devices.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS processes, offering high performance and low power consumption.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support, ideal for more robust construction in variable environments.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy integration with existing PCB designs and promotes easier assembly.

Maximum Supply Voltage (Vsup): 3 V

The maximum supply voltage rating provides headroom for operation while maintaining safety and efficiency.

Technical Specifications

Audio Control ICs TDA7463 attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

80 dB

General IC Type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2.4

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

3 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDA7463 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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