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TDA7052A/N2

NXP Semiconductors

TDA7052A/N2 by NXP Semiconductors

NXP Semiconductors' TDA7052A/N2 is an audio control IC with 0.3% harmonic distortion, 8 terminals, and operates b/w -40 to 85 °C. It is a volume control circuit in a rectangular plastic/epoxy package suitable for industrial applications.

Median Price

$0.787

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$0.787

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50

$0.787

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Digiode

USA . 4,663 parts In-Stock

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4,663

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Chip Stock

USA . 4,200 parts In-Stock

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Anansix

USA . 1,045 parts In-Stock

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Vyrian

USA . 618 parts In-Stock

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ABC Electronics Ltd.

UK . 10 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 8 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 259 parts In-Stock

1+ parts

$0.350

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Argo Parts USA

USA . 4,207 parts In-Stock

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$0.787

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Continental Prestige Electronics

USA . 3,153 parts In-Stock

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$0.787

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$0.771

3,153

$0.787

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$0.771

Netroflash

USA . 2,000 parts In-Stock

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$0.787

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$0.771

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$0.787

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Corohmni

South Africa . 63 parts In-Stock

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$1.819

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Ampacity Inc.

Singapore . 585 parts In-Stock

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$3.800

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585

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One Stop Electronics

USA . 543 parts In-Stock

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$10.800

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AZTECH Wire

Italy . 667 parts In-Stock

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$12.259

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Semicontronic

India . 415 parts In-Stock

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$17.800

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$17.355

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$17.266

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415

$17.800

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Lixinc

USA . 5,663 parts In-Stock

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UNI Independent Distributors

Spain . 3,400 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Perfect Parts

USA . 2,367 parts In-Stock

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Corphita

USA . 555 parts In-Stock

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Assy Fe

Spain . 17 parts In-Stock

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Overview

Elevate your audio experience with the TDA7052A/N2 by NXP Semiconductors. Crafted with precision and expertise, this Audio Control IC offers unmatched quality and performance in a compact package. Perfect for a wide range of applications, this Volume Control Circuit ensures crystal clear sound with minimal distortion. Whether you're designing a state-of-the-art sound system or upgrading your home entertainment setup, the TDA7052A/N2 delivers unparalleled value, benefits, and advantages to enhance your listening pleasure. Experience the difference with NXP Semiconductors today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and reliability in various environmental conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and placement on circuit boards.

General IC Type: VOLUME CONTROL CIRCUIT

The volume control circuit type allows for precise and accurate audio volume adjustments.

Harmonic Distortion: 0.3%

The low harmonic distortion of 0.3% ensures high-quality audio output with minimal distortion.

No. of Terminals: 8

The 8 terminals provide sufficient connectivity options for various audio control applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable performance in demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures operational stability even in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

The dual terminal position allows for easy and flexible connection options in circuit designs.

Maximum Seated Height: 4.2 mm

The maximum seated height of 4.2 mm enables compact and space-saving design implementations.

Width: 7.62 mm

The width of 7.62 mm offers a compact form factor for efficient PCB layout and integration.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement of 4.5 V allows for power-efficient operation.

Length: 9.5 mm

The length of 9.5 mm provides a balanced size for easy handling and installation in electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in various industrial applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the assembly process and enhances mechanical stability.

Terminal Pitch: 2.54 mm

The terminal pitch of 2.54 mm offers compatibility with standard PCB layouts and connectors.

Maximum Supply Voltage (Vsup): 18 V

The high maximum supply voltage of 18 V supports a wide range of audio control applications and power requirements.

Technical Specifications

Audio Control ICs TDA7052A/N2 attributes and parameters. Explore more Audio Control ICs devices from NXP Semiconductors

Specs

General IC Type:

Harmonic Distortion:

.3 %

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Length:

9.5 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDA7052A/N2 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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