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TDA7342EQ2NTR

STMicroelectronics

TDA7342EQ2NTR by STMicroelectronics

TDA7342EQ2NTR by STMicroelectronics is a BICMOS audio control IC designed for tone control applications. It features 100 dB channel separation, 0.01% harmonic distortion, and operates b/w 6-10.2 V. Ideal for industrial audio systems, it ensures high-quality sound performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Lakeland Logistics Inc

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,400

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-

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Bristol Electronics

USA . 2,400 parts In-Stock

1+ parts

-

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-

1k+ parts

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10k+ parts

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2,400

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Anansix

USA . 1,244 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,244

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-

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Digiode

USA . 997 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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997

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Vyrian

USA . 91 parts In-Stock

1+ parts

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91

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,322 parts In-Stock

1+ parts

$3.420

100+ parts

-

1k+ parts

$3.078

10k+ parts

-

1,322

$3.420

-

$3.078

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MKK Technologies

India . 1,176 parts In-Stock

1+ parts

$6.430

100+ parts

-

1k+ parts

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10k+ parts

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1,176

$6.430

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DigiPath Technology Company

USA . 1,176 parts In-Stock

1+ parts

$6.430

100+ parts

-

1k+ parts

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10k+ parts

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1,176

$6.430

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-

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Corphita

USA . 4,170 parts In-Stock

1+ parts

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4,170

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Parana Technologies

USA . 2,123 parts In-Stock

1+ parts

-

100+ parts

$4.089

1k+ parts

-

10k+ parts

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2,123

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$4.089

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Overview

Elevate your audio experience with the TDA7342EQ2NTR from STMicroelectronics, a leader in innovative technology. This high-performance audio control IC promises unmatched sound quality and clarity, delivering superior tone control with minimal distortion. Its robust design ensures exceptional reliability across diverse applications—from consumer electronics to automotive systems. Choose TDA7342EQ2NTR for enhanced audio performance that your customers will love!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and is well-suited for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for compact design and easier integration into modern PCBs.

Package Shape: SQUARE

The square package shape optimizes space usage on the PCB and supports better thermal performance.

General IC Type: TONE CONTROL CIRCUIT

Designed specifically as a tone control circuit, it ensures high-quality audio processing for various applications.

Channel Separation: 100 dB

High channel separation enhances audio clarity and ensures a more immersive listening experience.

Harmonic Distortion: 0.01 %

With very low harmonic distortion, this IC guarantees high-fidelity audio output, making it ideal for professional audio equipment.

Power Supplies (V): 9

Standard power supply voltage improves compatibility with a wide range of audio systems.

No. of Terminals: 32

A higher number of terminals allows for greater functionality and flexibility in circuit design.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile design makes it suitable for space-constrained applications while ensuring efficient mounting.

Maximum Operating Temperature: 85 °C

Operates efficiently in high-temperature environments, ensuring reliability in diverse applications.

No. of Bands: 2

Dual band configuration provides customizable sound control, catering to various audio preferences.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enhances reliability in extreme conditions, ideal for industrial applications.

Terminal Position: QUAD

Quad terminal positioning allows for easier layout and routing on the PCB.

Maximum Seated Height: 1.6 mm

Low seated height is beneficial for slim designs, maintaining a compact overall profile.

Width: 7 mm

Compact width facilitates versatile placement in various electronic devices.

Minimum Supply Voltage (Vsup): 6 V

Flexible supply voltage allows integration with a variety of existing power systems.

Length: 7 mm

The short length contributes to a compact design, ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance under harsh conditions, suitable for demanding applications.

No. of Channels: 2

Dual channel capability supports stereo audio applications, enhancing user experience.

Technology: BICMOS

BICMOS technology combines the advantages of bipolar and CMOS, providing excellent performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminals facilitate robust mechanical attachment and ease of soldering.

Terminal Pitch: 0.8 mm

Tight terminal pitch allows for high density in PCB design, maximizing functionality in limited space.

Maximum Supply Voltage (Vsup): 10.2 V

Higher supply voltage capability enables better performance and flexibility in various applications.

Technical Specifications

Audio Control ICs TDA7342EQ2NTR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

100 dB

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10.2 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TDA7342EQ2NTR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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