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TDA7463D013TR

STMicroelectronics

TDA7463D013TR by STMicroelectronics

TDA7463D013TR by STMicroelectronics is a dual-channel tone control IC with 80 dB channel separation, operating b/w 1.8V and 3V. It features a compact SO package (7.5mm x 10.3mm) and operates in temperatures from 0 °C to 70 °C. Ideal for audio applications, it enhances sound quality effectively.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,434 parts In-Stock

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8,434

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Digiode

USA . 4,993 parts In-Stock

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4,993

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Anansix

USA . 2,744 parts In-Stock

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2,744

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 929 parts In-Stock

1+ parts

$0.448

100+ parts

-

1k+ parts

$0.403

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-

929

$0.448

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$0.403

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MKK Technologies

India . 786 parts In-Stock

1+ parts

$0.843

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-

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786

$0.843

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DigiPath Technology Company

USA . 786 parts In-Stock

1+ parts

$0.843

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786

$0.843

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AZTECH Wire

Italy . 453 parts In-Stock

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$22.150

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453

$22.150

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QUARKTWIN TECHNOLOGY LTD

USA . 27,570 parts In-Stock

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27,570

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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Microchip USA

USA . 4,015 parts In-Stock

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4,015

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Corphita

USA . 1,169 parts In-Stock

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1,169

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Parana Technologies

USA . 522 parts In-Stock

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$0.536

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522

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$0.536

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Overview

Elevate your audio experience with the TDA7463D013TR from STMicroelectronics, a leader in innovation and quality. This advanced tone control IC offers exceptional channel separation and versatility for diverse applications, ensuring crystal-clear sound. Its compact design and reliable performance make it perfect for consumer electronics, automotive, and more. Trust in STMicroelectronics' commitment to excellence and unlock superior audio potential with the TDA7463D013TR!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures reliability and longevity, protecting the internal circuitry from environmental damage.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of space in electronic devices.

Package Shape: RECTANGULAR

Rectangular packaging facilitates easier placement on PCBs, optimizing layout and performance.

General IC Type: TONE CONTROL CIRCUIT

This tone control capability enhances audio quality, making it ideal for high-fidelity audio applications.

Channel Separation: 80 dB

A high channel separation level ensures minimal interference between audio channels, resulting in clearer sound reproduction.

Power Supplies (V): 2.4

Operating at a standard supply voltage simplifies integration into various audio systems.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options, accommodating multiple signal inputs and outputs.

Package Style (Meter): SMALL OUTLINE

The small outline style contributes to a compact design, making it suitable for space-constrained applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC can perform reliably in diverse thermal environments.

No. of Bands: 2

The dual-band capability allows finer control over audio frequencies, enhancing the listening experience.

Minimum Operating Temperature: 0 °C

Able to operate down to 0 °C, this IC is suitable for use in cooler conditions, broadening application potential.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish provides excellent conductivity and corrosion resistance, ensuring a long-lasting connection.

Terminal Position: DUAL

Dual terminal positioning offers flexible PCB layout options, optimizing device integration.

Maximum Seated Height: 2.65 mm

A low seated height is advantageous for space-saving designs, particularly in portable devices.

Width: 7.5 mm

The compact width allows this IC to fit into smaller, more condensed audio equipment.

Minimum Supply Voltage (Vsup): 1.8 V

A minimum supply voltage of 1.8V enables operation in low-power applications, promoting energy efficiency.

Length: 10.3 mm

The short length further aids in compact designs, ensuring efficient utilization of PCB space.

Temperature Grade: COMMERCIAL

This IC is designed for commercial temperatures, making it suitable for for a wide range of everyday applications.

No. of Channels: 2

Having two channels allows for stereo output, which is essential for modern audio systems.

Technology: BICMOS

The BICMOS technology combines the advantages of both bipolar and CMOS processes, resulting in high performance and low power consumption.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and assists in better mechanical stability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is commonly used, facilitating compatibility with standard PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, guiding proper handling and storage to ensure reliability.

Maximum Supply Voltage (Vsup): 3 V

The maximum supply voltage of 3V ensures compatibility with a wide range of power supplies, enhancing system integration.

Technical Specifications

Audio Control ICs TDA7463D013TR attributes and parameters. Explore more Audio Control ICs devices from STMicroelectronics

Specs

Channel Separation:

80 dB

General IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Bands:

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2.4

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Voltage (Vsup):

3 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA7463D013TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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